JPS5779630A - Assembling of semiconductor device - Google Patents
Assembling of semiconductor deviceInfo
- Publication number
- JPS5779630A JPS5779630A JP55155342A JP15534280A JPS5779630A JP S5779630 A JPS5779630 A JP S5779630A JP 55155342 A JP55155342 A JP 55155342A JP 15534280 A JP15534280 A JP 15534280A JP S5779630 A JPS5779630 A JP S5779630A
- Authority
- JP
- Japan
- Prior art keywords
- capillary tube
- semiconductor element
- bonding
- solder
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/073—
-
- H10W72/075—
-
- H10W72/07521—
-
- H10W72/50—
-
- H10W72/536—
-
- H10W72/5522—
-
- H10W72/884—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55155342A JPS5779630A (en) | 1980-11-05 | 1980-11-05 | Assembling of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55155342A JPS5779630A (en) | 1980-11-05 | 1980-11-05 | Assembling of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5779630A true JPS5779630A (en) | 1982-05-18 |
| JPS6122462B2 JPS6122462B2 (OSRAM) | 1986-05-31 |
Family
ID=15603789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55155342A Granted JPS5779630A (en) | 1980-11-05 | 1980-11-05 | Assembling of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5779630A (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0334764U (OSRAM) * | 1989-08-10 | 1991-04-04 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51430A (ja) * | 1974-06-22 | 1976-01-06 | Goro Nishizawa | Shitsunaigorufujugiho |
-
1980
- 1980-11-05 JP JP55155342A patent/JPS5779630A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51430A (ja) * | 1974-06-22 | 1976-01-06 | Goro Nishizawa | Shitsunaigorufujugiho |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6122462B2 (OSRAM) | 1986-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IT1167292B (it) | Dispositivo di riscaldamento e procedimento per la sua fabbricazione | |
| EP0321142A3 (en) | Soldering method using localized heat source | |
| JPS5779630A (en) | Assembling of semiconductor device | |
| JPS5723849A (en) | Gas detector and its manufacture | |
| JPS574130A (en) | Adhesion of semiconductor element | |
| JPS5565443A (en) | Manufacture of semiconductor device | |
| JPS55138246A (en) | Manufacture of semicondoctor device | |
| JPS57192908A (en) | Fixing method for soldering | |
| JPS54129880A (en) | Manufacture for semiconductor device | |
| JPS54107257A (en) | Semiconductor device mounting method | |
| JPS56162844A (en) | Semiconductor device and manufacture thereof | |
| DE3561912D1 (en) | A thermal limiting device | |
| JPS57139933A (en) | Assembling apparatus for semiconductor device | |
| JPS54119876A (en) | Manufacture for semiconductor device | |
| JPS5629350A (en) | Assebling of semiconductor device | |
| JPS5731147A (en) | Method and apparatus for aging of semiconductor device | |
| JPS5750440A (en) | Bonding device for inner lead | |
| JPS6454742A (en) | Bonding method and device | |
| JPS5731148A (en) | Manufacture of semiconductor device | |
| SU125837A1 (ru) | Способ припайки электродных выводов к индиевым электродам | |
| JPS57192040A (en) | Wire bonding method for semiconductor device | |
| JPS5745937A (en) | Manufacture of semiconductor device | |
| JPS5624940A (en) | Die bonding apparatus | |
| JPS5782151A (en) | Bonding method of mirror | |
| JPS5518029A (en) | Method of fabricating resin sealed type semiconductor device |