JPS577952A - Lead frame and its manufacturing device - Google Patents
Lead frame and its manufacturing deviceInfo
- Publication number
- JPS577952A JPS577952A JP8144980A JP8144980A JPS577952A JP S577952 A JPS577952 A JP S577952A JP 8144980 A JP8144980 A JP 8144980A JP 8144980 A JP8144980 A JP 8144980A JP S577952 A JPS577952 A JP S577952A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- tub
- pellet
- inspection
- manufacturing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10P74/00—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8144980A JPS577952A (en) | 1980-06-18 | 1980-06-18 | Lead frame and its manufacturing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8144980A JPS577952A (en) | 1980-06-18 | 1980-06-18 | Lead frame and its manufacturing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS577952A true JPS577952A (en) | 1982-01-16 |
Family
ID=13746704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8144980A Pending JPS577952A (en) | 1980-06-18 | 1980-06-18 | Lead frame and its manufacturing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS577952A (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2524708A1 (fr) * | 1982-04-02 | 1983-10-07 | Mitsubishi Electric Corp | Dispositif pour le refroidissement d'elements a semi-conducteurs |
| JPS58170846U (ja) * | 1982-05-07 | 1983-11-15 | 日本電気株式会社 | 半導体装置用リ−ドフレ−ム |
-
1980
- 1980-06-18 JP JP8144980A patent/JPS577952A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2524708A1 (fr) * | 1982-04-02 | 1983-10-07 | Mitsubishi Electric Corp | Dispositif pour le refroidissement d'elements a semi-conducteurs |
| JPS58170846U (ja) * | 1982-05-07 | 1983-11-15 | 日本電気株式会社 | 半導体装置用リ−ドフレ−ム |
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