JPS5779194A - Partially plating method for frame for electronic parts - Google Patents

Partially plating method for frame for electronic parts

Info

Publication number
JPS5779194A
JPS5779194A JP15539680A JP15539680A JPS5779194A JP S5779194 A JPS5779194 A JP S5779194A JP 15539680 A JP15539680 A JP 15539680A JP 15539680 A JP15539680 A JP 15539680A JP S5779194 A JPS5779194 A JP S5779194A
Authority
JP
Japan
Prior art keywords
frame
plating
resist film
requiring
plating process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15539680A
Other languages
Japanese (ja)
Inventor
Kazuo Ozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Plant Kogyo Kk
Original Assignee
Fuji Plant Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Plant Kogyo Kk filed Critical Fuji Plant Kogyo Kk
Priority to JP15539680A priority Critical patent/JPS5779194A/en
Publication of JPS5779194A publication Critical patent/JPS5779194A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To conduct the partial plating of a frame accurately and inexpensively even if the frame has complex patterns by coating each frame part requiring no plating with a resist film for a plating process together with the edge part and removing the resist film after the plating process.
CONSTITUTION: Various kinds of patterns which are not for mass production are provided to a substrate (a) to form an IC lead frame (b). Ink for a resist film with ductility and resistance to a plating soln. is applied to a part 5 of the frame (b) requiring plating from both sides, and the whole of each part 6 requiring no plating is coated with a resist film 7 for a plating process together with the edge part 9. After passing through the following plating process, the resist film 7 is removed from the frame (b).
COPYRIGHT: (C)1982,JPO&Japio
JP15539680A 1980-11-04 1980-11-04 Partially plating method for frame for electronic parts Pending JPS5779194A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15539680A JPS5779194A (en) 1980-11-04 1980-11-04 Partially plating method for frame for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15539680A JPS5779194A (en) 1980-11-04 1980-11-04 Partially plating method for frame for electronic parts

Publications (1)

Publication Number Publication Date
JPS5779194A true JPS5779194A (en) 1982-05-18

Family

ID=15605037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15539680A Pending JPS5779194A (en) 1980-11-04 1980-11-04 Partially plating method for frame for electronic parts

Country Status (1)

Country Link
JP (1) JPS5779194A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097714A (en) * 2003-08-25 2005-04-14 Matsushita Electric Ind Co Ltd Method of forming spot-plated film

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5137891A (en) * 1974-09-27 1976-03-30 Takeda Kosan Kk
JPS5269567A (en) * 1975-12-08 1977-06-09 Mitsubishi Electric Corp Partial plating method for electronic parts

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5137891A (en) * 1974-09-27 1976-03-30 Takeda Kosan Kk
JPS5269567A (en) * 1975-12-08 1977-06-09 Mitsubishi Electric Corp Partial plating method for electronic parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097714A (en) * 2003-08-25 2005-04-14 Matsushita Electric Ind Co Ltd Method of forming spot-plated film

Similar Documents

Publication Publication Date Title
IL56000A (en) Process for the production of solder masks on printed circuits
HK1000135A1 (en) A method and an apparatus for selectively electroplating apertured metal or metallized products
JPS57190912A (en) Production of color filter
JPS5779194A (en) Partially plating method for frame for electronic parts
JPS52139374A (en) Alignment pattern forming method for mask alignment
JPS56137633A (en) Pattern forming
JPS5767194A (en) Continuous method of partial plating for metallic strip
JPS5431282A (en) Pattern formation method
JPS56156792A (en) Thickly plating method
JPS5387668A (en) Forming method of patterns
JPS52155066A (en) Screening method of thin metal film wirings of semiconductor device
JPS53138056A (en) Method of coating resin layer on printed circuit board metal material substrate having through hole
JPS55160490A (en) Method of fabricating through hole type printed circuti board by electrophotographic process
JPS55103555A (en) Registering method for screen printing
JPS5338266A (en) Screening method of semiconductors and device for the same
JPS53101975A (en) Treating method of semiconductor substrates
JPS52127174A (en) Minute patern formation method
JPS5324261A (en) Manufacture of electronic redi ation material
JPS56144550A (en) Circuit substrate
JPS56158895A (en) Method for painting on metallic surface
JPS53124976A (en) Mounting method of electronic parts
JPS5586769A (en) Ink jet recording head
JPS5224244A (en) Electrodeposition coating method
JPS5364484A (en) Formation method of logic circuit
JPS5381079A (en) Mask forming method