JPS5778156A - Semiconductor integrated circuit sealing device - Google Patents
Semiconductor integrated circuit sealing deviceInfo
- Publication number
- JPS5778156A JPS5778156A JP55154865A JP15486580A JPS5778156A JP S5778156 A JPS5778156 A JP S5778156A JP 55154865 A JP55154865 A JP 55154865A JP 15486580 A JP15486580 A JP 15486580A JP S5778156 A JPS5778156 A JP S5778156A
- Authority
- JP
- Japan
- Prior art keywords
- sealing device
- chip
- integrated circuit
- semiconductor integrated
- containing space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55154865A JPS5778156A (en) | 1980-11-04 | 1980-11-04 | Semiconductor integrated circuit sealing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55154865A JPS5778156A (en) | 1980-11-04 | 1980-11-04 | Semiconductor integrated circuit sealing device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5778156A true JPS5778156A (en) | 1982-05-15 |
Family
ID=15593601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55154865A Pending JPS5778156A (en) | 1980-11-04 | 1980-11-04 | Semiconductor integrated circuit sealing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5778156A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5574314A (en) * | 1994-07-28 | 1996-11-12 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device including shielded inner walls |
-
1980
- 1980-11-04 JP JP55154865A patent/JPS5778156A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5574314A (en) * | 1994-07-28 | 1996-11-12 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device including shielded inner walls |
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