JPS5775449A - Manufacture of airtight terminal - Google Patents
Manufacture of airtight terminalInfo
- Publication number
- JPS5775449A JPS5775449A JP15163580A JP15163580A JPS5775449A JP S5775449 A JPS5775449 A JP S5775449A JP 15163580 A JP15163580 A JP 15163580A JP 15163580 A JP15163580 A JP 15163580A JP S5775449 A JPS5775449 A JP S5775449A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- pipe lead
- copper
- flat part
- airtight terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 5
- 229910052802 copper Inorganic materials 0.000 abstract 5
- 239000010949 copper Substances 0.000 abstract 5
- 239000011521 glass Substances 0.000 abstract 2
- 230000000903 blocking effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
PURPOSE:To manufacture the airtight terminal characterized by excellent airtightness by forming a copper plated layer at least on the inner surface of a pipe lead, and then crushing one end thereof to obtain a flat shape, and airtightly blocking the crushed flat part by copper braze. CONSTITUTION:The copper plated layer 14 is formed over the entire surface of the pipe lead 13. Then, one end thereof is compressed and the crushed flat part 15 is formed. Then the exposed layer 14 is separated. Thereafter the heating is performed up to the temperature higher than the melting point of the layer 14, and the layer 14 is fused and the copper braze 16 is obtained. The flat part 15 is blocked airtightly by said copper braze 16. Then, by using a sealing jig 17, the pipe lead 13 is assembled at a specified position together with a metallic outer ring 11 and a sintered glass doublet 12a. The outer ring 11 and the pipe lead 13 are sealed airtightly via glass 12. Thus, the airtight terminal characterized by excellent airtightness can be readily manufactured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15163580A JPS5775449A (en) | 1980-10-29 | 1980-10-29 | Manufacture of airtight terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15163580A JPS5775449A (en) | 1980-10-29 | 1980-10-29 | Manufacture of airtight terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5775449A true JPS5775449A (en) | 1982-05-12 |
| JPS618586B2 JPS618586B2 (en) | 1986-03-15 |
Family
ID=15522847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15163580A Granted JPS5775449A (en) | 1980-10-29 | 1980-10-29 | Manufacture of airtight terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5775449A (en) |
-
1980
- 1980-10-29 JP JP15163580A patent/JPS5775449A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS618586B2 (en) | 1986-03-15 |
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