JPS5772771A - Method for coating flux on wiring substrate for soldering - Google Patents

Method for coating flux on wiring substrate for soldering

Info

Publication number
JPS5772771A
JPS5772771A JP55147853A JP14785380A JPS5772771A JP S5772771 A JPS5772771 A JP S5772771A JP 55147853 A JP55147853 A JP 55147853A JP 14785380 A JP14785380 A JP 14785380A JP S5772771 A JPS5772771 A JP S5772771A
Authority
JP
Japan
Prior art keywords
flux
wiring substrate
roll
paper
backing film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55147853A
Other languages
English (en)
Other versions
JPS6255469B2 (ja
Inventor
Yoshiyasu Noguchi
Shoji Yokokoji
Shozo Saito
Kiketsu Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koki Co Ltd
Kouki KK
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Koki Co Ltd
Kouki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd, Koki Co Ltd, Kouki KK filed Critical Toppan Printing Co Ltd
Priority to JP55147853A priority Critical patent/JPS5772771A/ja
Priority to US06/312,820 priority patent/US4429457A/en
Publication of JPS5772771A publication Critical patent/JPS5772771A/ja
Publication of JPS6255469B2 publication Critical patent/JPS6255469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP55147853A 1980-10-22 1980-10-22 Method for coating flux on wiring substrate for soldering Granted JPS5772771A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP55147853A JPS5772771A (en) 1980-10-22 1980-10-22 Method for coating flux on wiring substrate for soldering
US06/312,820 US4429457A (en) 1980-10-22 1981-10-19 Process for manufacturing a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55147853A JPS5772771A (en) 1980-10-22 1980-10-22 Method for coating flux on wiring substrate for soldering

Publications (2)

Publication Number Publication Date
JPS5772771A true JPS5772771A (en) 1982-05-07
JPS6255469B2 JPS6255469B2 (ja) 1987-11-19

Family

ID=15439730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55147853A Granted JPS5772771A (en) 1980-10-22 1980-10-22 Method for coating flux on wiring substrate for soldering

Country Status (2)

Country Link
US (1) US4429457A (ja)
JP (1) JPS5772771A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57189406A (en) * 1981-05-19 1982-11-20 Nikkan Ind Protecting agent for conductor and protecting sheet
JP2000288771A (ja) * 1999-04-09 2000-10-17 Senju Metal Ind Co Ltd はんだボールおよびはんだボールの被覆方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5145722A (en) * 1989-04-11 1992-09-08 Hughes Aircraft Company Method and composition for protecting and enhancing the solderability of metallic surfaces
EP0397929A1 (en) * 1989-05-17 1990-11-22 Soltec B.V. Printed circuit board with improved soldering qualities
BRPI0017633B1 (pt) * 1999-12-03 2016-10-04 Fry S Metals Inc D B A Alpha Metals Inc processo para tratamento de painel de circuito impresso, bem como painel de circuito impresso
JP2001345544A (ja) * 2000-05-31 2001-12-14 Sony Corp プリント配線基板の表面処理装置及び表面処理方法
US9073153B2 (en) * 2010-02-09 2015-07-07 Nordson Corporation Flux and solder material and method of making same
CN103056556B (zh) * 2012-03-20 2015-03-04 浙江亚通焊材有限公司 表面涂覆无卤素助焊剂的预成型焊片
IL250954B (en) * 2017-03-06 2019-08-29 Netta Weinroth A turbine system for producing electrical energy and a method therefor
CN113316495A (zh) * 2019-02-22 2021-08-27 哈利玛化成株式会社 固态钎焊材的涂布方法、涂布物制造方法、涂布装置和卷状固态钎焊材

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5510358A (en) * 1978-07-10 1980-01-24 Nippon Steel Corp Fused flux for submerged arc welding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5510358A (en) * 1978-07-10 1980-01-24 Nippon Steel Corp Fused flux for submerged arc welding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57189406A (en) * 1981-05-19 1982-11-20 Nikkan Ind Protecting agent for conductor and protecting sheet
JP2000288771A (ja) * 1999-04-09 2000-10-17 Senju Metal Ind Co Ltd はんだボールおよびはんだボールの被覆方法

Also Published As

Publication number Publication date
US4429457A (en) 1984-02-07
JPS6255469B2 (ja) 1987-11-19

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