JPS577138A - Separation of semiconductor wafer - Google Patents

Separation of semiconductor wafer

Info

Publication number
JPS577138A
JPS577138A JP8172180A JP8172180A JPS577138A JP S577138 A JPS577138 A JP S577138A JP 8172180 A JP8172180 A JP 8172180A JP 8172180 A JP8172180 A JP 8172180A JP S577138 A JPS577138 A JP S577138A
Authority
JP
Japan
Prior art keywords
wafer
100mum
grooves
separating
separation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8172180A
Other languages
English (en)
Other versions
JPS5951746B2 (ja
Inventor
Masayasu Abe
Masafumi Miyagawa
Masaharu Aoyama
Toshio Yonezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55081721A priority Critical patent/JPS5951746B2/ja
Publication of JPS577138A publication Critical patent/JPS577138A/ja
Publication of JPS5951746B2 publication Critical patent/JPS5951746B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP55081721A 1980-06-17 1980-06-17 半導体ウェハの分離方法 Expired JPS5951746B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55081721A JPS5951746B2 (ja) 1980-06-17 1980-06-17 半導体ウェハの分離方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55081721A JPS5951746B2 (ja) 1980-06-17 1980-06-17 半導体ウェハの分離方法

Publications (2)

Publication Number Publication Date
JPS577138A true JPS577138A (en) 1982-01-14
JPS5951746B2 JPS5951746B2 (ja) 1984-12-15

Family

ID=13754273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55081721A Expired JPS5951746B2 (ja) 1980-06-17 1980-06-17 半導体ウェハの分離方法

Country Status (1)

Country Link
JP (1) JPS5951746B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102152408A (zh) * 2010-12-13 2011-08-17 深圳顺络电子股份有限公司 一种片式元件陶瓷膜片的打孔模具、打孔设备及打孔方法
CN109968552A (zh) * 2019-03-26 2019-07-05 紫光宏茂微电子(上海)有限公司 一体化晶圆切割刀及晶圆切割方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01176045U (ja) * 1988-05-26 1989-12-14
JPH047443U (ja) * 1990-04-28 1992-01-23

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102152408A (zh) * 2010-12-13 2011-08-17 深圳顺络电子股份有限公司 一种片式元件陶瓷膜片的打孔模具、打孔设备及打孔方法
CN109968552A (zh) * 2019-03-26 2019-07-05 紫光宏茂微电子(上海)有限公司 一体化晶圆切割刀及晶圆切割方法

Also Published As

Publication number Publication date
JPS5951746B2 (ja) 1984-12-15

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