JPS5771146A - Dicing apparatus for semiconductor wafer - Google Patents

Dicing apparatus for semiconductor wafer

Info

Publication number
JPS5771146A
JPS5771146A JP14705280A JP14705280A JPS5771146A JP S5771146 A JPS5771146 A JP S5771146A JP 14705280 A JP14705280 A JP 14705280A JP 14705280 A JP14705280 A JP 14705280A JP S5771146 A JPS5771146 A JP S5771146A
Authority
JP
Japan
Prior art keywords
signal
dicing
line
position setting
pictures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14705280A
Other languages
Japanese (ja)
Inventor
Nobushi Suzuki
Sumio Nagashima
Katsuhiko Aoyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14705280A priority Critical patent/JPS5771146A/en
Publication of JPS5771146A publication Critical patent/JPS5771146A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To automate position setting and to improve productivity and yield by a method wherein a diced line of a wafer is detected with an optoelectrical method at two points along the parallel line to a travelling direction of a table, and by a detecged signal a table is rotationally controlled. CONSTITUTION:A wafer fixed on a table 3 is taken into an image with a TV camera 10 through an optical system 7 in a viewing part 8, 9, and sampling is done by putting a signal of left and right pictures P1, P2 into a computer 12 by turning them into binary logic. When a dicing line 15 is skewed to an X direction, dicing lines 15 on pictures P1, P2 are out of matching, by detection from a sampled signal, through an interface 11 and by a signal sent to a theta-motor 6 an angle of the table 3 is adjusted. Next sampling of a picture is performed again, and after detecting coincidence between dicing lines 15, a dicing process is started. Thus by position setting performed in an automatic manner, work can be efficient and accurate, and occurrence of fault can be prevented.
JP14705280A 1980-10-21 1980-10-21 Dicing apparatus for semiconductor wafer Pending JPS5771146A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14705280A JPS5771146A (en) 1980-10-21 1980-10-21 Dicing apparatus for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14705280A JPS5771146A (en) 1980-10-21 1980-10-21 Dicing apparatus for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5771146A true JPS5771146A (en) 1982-05-01

Family

ID=15421407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14705280A Pending JPS5771146A (en) 1980-10-21 1980-10-21 Dicing apparatus for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5771146A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60207351A (en) * 1984-03-31 1985-10-18 Toshiba Seiki Kk Adjusting method of wafer dicing line angle
JPS60207350A (en) * 1984-03-31 1985-10-18 Toshiba Seiki Kk Adjusting method of wafer dicing line angle

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60207351A (en) * 1984-03-31 1985-10-18 Toshiba Seiki Kk Adjusting method of wafer dicing line angle
JPS60207350A (en) * 1984-03-31 1985-10-18 Toshiba Seiki Kk Adjusting method of wafer dicing line angle

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