JPS5768018A - Manufacture of semiamorphous semiconductor - Google Patents
Manufacture of semiamorphous semiconductorInfo
- Publication number
- JPS5768018A JPS5768018A JP55143886A JP14388680A JPS5768018A JP S5768018 A JPS5768018 A JP S5768018A JP 55143886 A JP55143886 A JP 55143886A JP 14388680 A JP14388680 A JP 14388680A JP S5768018 A JPS5768018 A JP S5768018A
- Authority
- JP
- Japan
- Prior art keywords
- tube
- periphery
- film
- 1atm
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Abstract
PURPOSE:To obtain a film having stable free energy by introducing silicide or germanium gas having association or polymerization structure in the reaction system of hydrogen suspension atmosphere under reduced pressure less than 1atm and growing amorphous or semicrystalline columnar semiconductor film on the growing surface to be covered at lower than 600 deg.C. CONSTITUTION:Substrates 10 of clustered conductors or insulators arranged at an interval on a quartz boat 9 are contained in a reaction tube 7 having a larger diameter than an activation chamber 1 of reactive gas disposed at the end, and a resistance heating oven 8 having power sufficient to apply enough induction energy to the reactive gas is provided at the periphery of the tube 7. The outer periphery of the chamber 1 is cooled with Freon or the like, an isolator matching unit 2 connected to an oscillator is wound on the periphery, and the interior of the tube 7 is reduced to lower than 1atm. by a vacuum pump 13 through a needle valve 11 and a stop valve 12. With the construction thus composed, the substrate 10 is maintained at lower than 600 deg.C, silane 4, silicon fluoride 5 and carrier gas 6 are flowed thereto, and a desired semiamorphous film is grown on the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55143886A JPS5768018A (en) | 1980-10-15 | 1980-10-15 | Manufacture of semiamorphous semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55143886A JPS5768018A (en) | 1980-10-15 | 1980-10-15 | Manufacture of semiamorphous semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5768018A true JPS5768018A (en) | 1982-04-26 |
Family
ID=15349306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55143886A Pending JPS5768018A (en) | 1980-10-15 | 1980-10-15 | Manufacture of semiamorphous semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5768018A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0140660A2 (en) * | 1983-10-31 | 1985-05-08 | Dow Corning Corporation | Method of forming amorphous polymeric halosilane films and products produced therefrom |
-
1980
- 1980-10-15 JP JP55143886A patent/JPS5768018A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0140660A2 (en) * | 1983-10-31 | 1985-05-08 | Dow Corning Corporation | Method of forming amorphous polymeric halosilane films and products produced therefrom |
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