JPS57678B2 - - Google Patents

Info

Publication number
JPS57678B2
JPS57678B2 JP5215479A JP5215479A JPS57678B2 JP S57678 B2 JPS57678 B2 JP S57678B2 JP 5215479 A JP5215479 A JP 5215479A JP 5215479 A JP5215479 A JP 5215479A JP S57678 B2 JPS57678 B2 JP S57678B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5215479A
Other languages
Japanese (ja)
Other versions
JPS55145396A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5215479A priority Critical patent/JPS55145396A/ja
Priority to US06/199,497 priority patent/US4376154A/en
Publication of JPS55145396A publication Critical patent/JPS55145396A/ja
Publication of JPS57678B2 publication Critical patent/JPS57678B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/16—Tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/20—Zinc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12785—Group IIB metal-base component
    • Y10T428/12792—Zn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP5215479A 1979-04-27 1979-04-27 Copper foil for printed circuit and method of fabricating same Granted JPS55145396A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP5215479A JPS55145396A (en) 1979-04-27 1979-04-27 Copper foil for printed circuit and method of fabricating same
US06/199,497 US4376154A (en) 1979-04-27 1980-10-22 Copper foil for a printed circuit and a method for the production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5215479A JPS55145396A (en) 1979-04-27 1979-04-27 Copper foil for printed circuit and method of fabricating same

Publications (2)

Publication Number Publication Date
JPS55145396A JPS55145396A (en) 1980-11-12
JPS57678B2 true JPS57678B2 (cg-RX-API-DMAC7.html) 1982-01-07

Family

ID=12906932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5215479A Granted JPS55145396A (en) 1979-04-27 1979-04-27 Copper foil for printed circuit and method of fabricating same

Country Status (2)

Country Link
US (1) US4376154A (cg-RX-API-DMAC7.html)
JP (1) JPS55145396A (cg-RX-API-DMAC7.html)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155593A (en) * 1980-04-08 1981-12-01 Furukawa Circuit Foil Steel foil for printed circuit and method of manufacturing same
JPS6113688A (ja) * 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 印刷回路用銅箔およびその製造方法
JPS61110794A (ja) * 1984-11-06 1986-05-29 Mitsui Mining & Smelting Co Ltd 銅箔の表面処理方法
US5022968A (en) * 1990-09-20 1991-06-11 Olin Corporation Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil
US5250363A (en) * 1989-10-13 1993-10-05 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil having a dark color
US5098796A (en) * 1989-10-13 1992-03-24 Olin Corporation Chromium-zinc anti-tarnish coating on copper foil
US5230932A (en) * 1989-10-13 1993-07-27 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil
TW208110B (cg-RX-API-DMAC7.html) * 1990-06-08 1993-06-21 Furukawa Circuit Foil Kk
DE19511656C2 (de) * 1995-03-30 1997-11-27 Wieland Werke Ag Partiell feuerverzinntes Band
TW420729B (en) * 1996-02-12 2001-02-01 Gould Electronics Inc A non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath
US5885436A (en) * 1997-08-06 1999-03-23 Gould Electronics Inc. Adhesion enhancement for metal foil
US6086743A (en) * 1997-08-06 2000-07-11 Gould Electronics, Inc. Adhesion enhancement for metal foil
US6183886B1 (en) * 1998-04-03 2001-02-06 Olin Corporation Tin coatings incorporating selected elemental additions to reduce discoloration
US6524723B2 (en) * 2000-04-28 2003-02-25 Fukuda Metal Foil & Powder Co., Ltd. Copper foil for printed circuit boards and its surface treatment method
KR100701645B1 (ko) * 2004-08-02 2007-03-30 도레이새한 주식회사 연성회로기판용 적층구조체의 제조방법
KR101148031B1 (ko) * 2010-08-11 2012-05-24 고려대학교 산학협력단 내부식성 태양전지 모듈
PH12013501034B1 (en) * 2010-11-22 2018-01-12 Mitsui Mining & Smelting Co Ltd Surface treated copper foil
JP5776630B2 (ja) * 2012-06-01 2015-09-09 日立金属株式会社 銅系材料及びその製造方法
KR101497192B1 (ko) * 2012-12-27 2015-02-27 삼성전기주식회사 전자부품 내장 인쇄회로기판 및 그 제조방법
JP5742859B2 (ja) 2013-01-30 2015-07-01 日立金属株式会社 高速伝送ケーブル用導体、及びその製造方法、並びに高速伝送ケーブル
JP6123655B2 (ja) 2013-11-29 2017-05-10 日立金属株式会社 銅箔及びその製造方法
JP6287126B2 (ja) 2013-11-29 2018-03-07 日立金属株式会社 プリント配線板及びその製造方法
CN104372384B (zh) * 2014-11-18 2016-08-17 安徽铜冠铜箔有限公司 一种超厚电子铜箔的制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA643817A (en) 1962-06-26 American Can Company Metal surface treatment
US2907702A (en) 1954-04-27 1959-10-06 Sylvania Electric Prod Anodes for electroplating bath
US3857681A (en) * 1971-08-03 1974-12-31 Yates Industries Copper foil treatment and products produced therefrom
JPS5139539A (ja) * 1974-09-20 1976-04-02 Yates Industries Donosuitanitaishuseiomotaserudenkaishiki hoho
JPS5856758B2 (ja) * 1975-12-17 1983-12-16 ミツイアナコンダドウハク カブシキガイシヤ ドウハクヒヨウメンシヨリホウホウ
JPS5853079B2 (ja) * 1976-03-15 1983-11-26 三井アナコンダ銅箔株式会社 銅箔の防錆方法
JPS5554588A (en) * 1978-10-13 1980-04-21 Nippon Steel Corp Production of high corrosion-resistant electroplated steel plate

Also Published As

Publication number Publication date
US4376154A (en) 1983-03-08
JPS55145396A (en) 1980-11-12

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