JPS5764950A - Electrostatically attracting device and method therefor - Google Patents

Electrostatically attracting device and method therefor

Info

Publication number
JPS5764950A
JPS5764950A JP14104680A JP14104680A JPS5764950A JP S5764950 A JPS5764950 A JP S5764950A JP 14104680 A JP14104680 A JP 14104680A JP 14104680 A JP14104680 A JP 14104680A JP S5764950 A JPS5764950 A JP S5764950A
Authority
JP
Japan
Prior art keywords
electrodes
attracted
insulator
capacity
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14104680A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0152899B2 (enrdf_load_stackoverflow
Inventor
Naomichi Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14104680A priority Critical patent/JPS5764950A/ja
Priority to US06/304,902 priority patent/US4384918A/en
Priority to DE8181304409T priority patent/DE3171924D1/de
Priority to EP81304409A priority patent/EP0049588B1/en
Priority to IE2268/81A priority patent/IE52318B1/en
Publication of JPS5764950A publication Critical patent/JPS5764950A/ja
Publication of JPH0152899B2 publication Critical patent/JPH0152899B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Weting (AREA)
JP14104680A 1980-09-30 1980-10-08 Electrostatically attracting device and method therefor Granted JPS5764950A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP14104680A JPS5764950A (en) 1980-10-08 1980-10-08 Electrostatically attracting device and method therefor
US06/304,902 US4384918A (en) 1980-09-30 1981-09-23 Method and apparatus for dry etching and electrostatic chucking device used therein
DE8181304409T DE3171924D1 (en) 1980-09-30 1981-09-24 Method and apparatus for dry etching and electrostatic chucking device used therein
EP81304409A EP0049588B1 (en) 1980-09-30 1981-09-24 Method and apparatus for dry etching and electrostatic chucking device used therein
IE2268/81A IE52318B1 (en) 1980-09-30 1981-09-29 Method and apparatus for dry etching and electrostatic chucking device used therein

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14104680A JPS5764950A (en) 1980-10-08 1980-10-08 Electrostatically attracting device and method therefor

Publications (2)

Publication Number Publication Date
JPS5764950A true JPS5764950A (en) 1982-04-20
JPH0152899B2 JPH0152899B2 (enrdf_load_stackoverflow) 1989-11-10

Family

ID=15282984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14104680A Granted JPS5764950A (en) 1980-09-30 1980-10-08 Electrostatically attracting device and method therefor

Country Status (1)

Country Link
JP (1) JPS5764950A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5848434A (ja) * 1981-09-17 1983-03-22 Toshiba Corp 静電チヤツク装置
JPS5979524A (ja) * 1982-10-29 1984-05-08 Toshiba Corp 試料保持用静電チヤツクカセツト装置
JPH01274938A (ja) * 1988-04-26 1989-11-02 Toto Ltd 静電チャック基板
JPH03104529A (ja) * 1989-09-19 1991-05-01 Fujitsu Ltd 静電チャック
JPH06120329A (ja) * 1992-08-20 1994-04-28 Fujitsu Ltd ウエハの静電吸着装置、ウエハの静電吸着方法、ウエハの離脱方法及びドライエッチング方法
US5539179A (en) * 1990-11-17 1996-07-23 Tokyo Electron Limited Electrostatic chuck having a multilayer structure for attracting an object
JP2006049357A (ja) * 2004-07-30 2006-02-16 Toto Ltd 静電チャックおよび静電チャックを搭載した装置
US9384946B2 (en) 2012-01-12 2016-07-05 Hitachi High-Technologies Corporation Plasma processing apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001297971A (ja) * 2000-04-14 2001-10-26 Ulvac Japan Ltd 露光装置
JP4640876B2 (ja) * 2000-06-13 2011-03-02 株式会社アルバック 基板搬送装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5848434A (ja) * 1981-09-17 1983-03-22 Toshiba Corp 静電チヤツク装置
JPS5979524A (ja) * 1982-10-29 1984-05-08 Toshiba Corp 試料保持用静電チヤツクカセツト装置
JPH01274938A (ja) * 1988-04-26 1989-11-02 Toto Ltd 静電チャック基板
JPH03104529A (ja) * 1989-09-19 1991-05-01 Fujitsu Ltd 静電チャック
US5539179A (en) * 1990-11-17 1996-07-23 Tokyo Electron Limited Electrostatic chuck having a multilayer structure for attracting an object
JPH06120329A (ja) * 1992-08-20 1994-04-28 Fujitsu Ltd ウエハの静電吸着装置、ウエハの静電吸着方法、ウエハの離脱方法及びドライエッチング方法
JP2006049357A (ja) * 2004-07-30 2006-02-16 Toto Ltd 静電チャックおよび静電チャックを搭載した装置
US9384946B2 (en) 2012-01-12 2016-07-05 Hitachi High-Technologies Corporation Plasma processing apparatus

Also Published As

Publication number Publication date
JPH0152899B2 (enrdf_load_stackoverflow) 1989-11-10

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