JPS576251U - - Google Patents

Info

Publication number
JPS576251U
JPS576251U JP8238980U JP8238980U JPS576251U JP S576251 U JPS576251 U JP S576251U JP 8238980 U JP8238980 U JP 8238980U JP 8238980 U JP8238980 U JP 8238980U JP S576251 U JPS576251 U JP S576251U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8238980U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8238980U priority Critical patent/JPS576251U/ja
Publication of JPS576251U publication Critical patent/JPS576251U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP8238980U 1980-06-11 1980-06-11 Pending JPS576251U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8238980U JPS576251U (fr) 1980-06-11 1980-06-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8238980U JPS576251U (fr) 1980-06-11 1980-06-11

Publications (1)

Publication Number Publication Date
JPS576251U true JPS576251U (fr) 1982-01-13

Family

ID=29444745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8238980U Pending JPS576251U (fr) 1980-06-11 1980-06-11

Country Status (1)

Country Link
JP (1) JPS576251U (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017631A (ja) * 2001-06-28 2003-01-17 Sanyo Electric Co Ltd 混成集積回路装置およびその製造方法
JP2008028011A (ja) * 2006-07-19 2008-02-07 Denso Corp モールドパッケージおよびその製造方法
JP2014123606A (ja) * 2012-12-20 2014-07-03 Shindengen Electric Mfg Co Ltd 電源装置およびその製造方法
CN104025287A (zh) * 2011-10-31 2014-09-03 罗姆股份有限公司 半导体装置
JP2015026791A (ja) * 2013-07-29 2015-02-05 新電元工業株式会社 半導体装置及びリードフレーム
EP3703118A4 (fr) * 2017-10-26 2020-09-02 Shindengen Electric Manufacturing Co., Ltd. Dispositif semi-conducteur

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4985961A (fr) * 1972-12-22 1974-08-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4985961A (fr) * 1972-12-22 1974-08-17

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017631A (ja) * 2001-06-28 2003-01-17 Sanyo Electric Co Ltd 混成集積回路装置およびその製造方法
JP4623871B2 (ja) * 2001-06-28 2011-02-02 三洋電機株式会社 混成集積回路装置
JP2008028011A (ja) * 2006-07-19 2008-02-07 Denso Corp モールドパッケージおよびその製造方法
CN104025287A (zh) * 2011-10-31 2014-09-03 罗姆股份有限公司 半导体装置
JP2014123606A (ja) * 2012-12-20 2014-07-03 Shindengen Electric Mfg Co Ltd 電源装置およびその製造方法
JP2015026791A (ja) * 2013-07-29 2015-02-05 新電元工業株式会社 半導体装置及びリードフレーム
EP3703118A4 (fr) * 2017-10-26 2020-09-02 Shindengen Electric Manufacturing Co., Ltd. Dispositif semi-conducteur
US11309232B2 (en) 2017-10-26 2022-04-19 Shindengen Electric Manufacturing Co., Ltd. Semiconductor device

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