JPS5760861A - Semiconductor oscillator - Google Patents

Semiconductor oscillator

Info

Publication number
JPS5760861A
JPS5760861A JP13545480A JP13545480A JPS5760861A JP S5760861 A JPS5760861 A JP S5760861A JP 13545480 A JP13545480 A JP 13545480A JP 13545480 A JP13545480 A JP 13545480A JP S5760861 A JPS5760861 A JP S5760861A
Authority
JP
Japan
Prior art keywords
electrodes
metallized layers
layers
metallized
adjoining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13545480A
Other languages
English (en)
Inventor
Hiroshi Morikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13545480A priority Critical patent/JPS5760861A/ja
Publication of JPS5760861A publication Critical patent/JPS5760861A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732Diamonds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
JP13545480A 1980-09-29 1980-09-29 Semiconductor oscillator Pending JPS5760861A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13545480A JPS5760861A (en) 1980-09-29 1980-09-29 Semiconductor oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13545480A JPS5760861A (en) 1980-09-29 1980-09-29 Semiconductor oscillator

Publications (1)

Publication Number Publication Date
JPS5760861A true JPS5760861A (en) 1982-04-13

Family

ID=15152083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13545480A Pending JPS5760861A (en) 1980-09-29 1980-09-29 Semiconductor oscillator

Country Status (1)

Country Link
JP (1) JPS5760861A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5294381A (en) * 1991-10-21 1994-03-15 Sumitomo Electric Industries, Ltd. Method of manufacturing a diamond heat sink
WO1998032171A1 (de) * 1997-01-18 1998-07-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Diamantkörper

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5495126A (en) * 1991-01-21 1996-02-27 Sumitomo Electric Industries, Ltd. Polycrystalline diamond heat sink having major surfaces electrically insulated from each other
US5294381A (en) * 1991-10-21 1994-03-15 Sumitomo Electric Industries, Ltd. Method of manufacturing a diamond heat sink
WO1998032171A1 (de) * 1997-01-18 1998-07-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Diamantkörper
US6536509B1 (en) 1997-01-18 2003-03-25 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Diamond body

Similar Documents

Publication Publication Date Title
EP0890989A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE DEVICE
US5128951A (en) Laser diode array and method of fabrication thereof
US4598308A (en) Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
DE3578273D1 (de) Verdrahtungslagen in halbleiterbauelementen.
KR970018887A (ko) 히트 싱크를 가지는 레이저 다이오드 소자
EP0340527A3 (en) Improved semiconductor device packaging structures
EP0337686A3 (en) Semiconductor chip module
JPH04299585A (ja) 熱電変換モジュールの製造方法
EP0161734A3 (en) Integrated circuit architecture and fabrication method therefor
JPS55165691A (en) Compound semiconductor laser element
US4687879A (en) Tiered thermoelectric unit and method of fabricating same
EP0361825A3 (en) Semiconductor chip and method of manufacturing it
JPS5760861A (en) Semiconductor oscillator
ES316181A1 (es) Un metodo de fabricar dispositivos semiconductores pasivados.
GB2083285A (en) Over/under dual in-line chip package
EP0349021A3 (en) Semiconductor device and method of manufacturing the same
US3237281A (en) Method of making thermoelectric devices
JPS57126154A (en) Lsi package
JPS54139415A (en) Semiconductor channel switch
US3913216A (en) Method for fabricating a precision aligned semiconductor array
JPS6453488A (en) Manufacture of light emitting semiconductor device
DE3373378D1 (en) Process for making electrical chip components
JPS55165657A (en) Multi-chip package
JPS6459843A (en) Semiconductor device
JPS6484753A (en) Optical connection circuit