JPS5759328A - Method for fixed exfoliation of sample - Google Patents

Method for fixed exfoliation of sample

Info

Publication number
JPS5759328A
JPS5759328A JP55134618A JP13461880A JPS5759328A JP S5759328 A JPS5759328 A JP S5759328A JP 55134618 A JP55134618 A JP 55134618A JP 13461880 A JP13461880 A JP 13461880A JP S5759328 A JPS5759328 A JP S5759328A
Authority
JP
Japan
Prior art keywords
sample
resist
exfoliation
bonding agent
developing solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55134618A
Other languages
Japanese (ja)
Other versions
JPS623972B2 (en
Inventor
Toru Tojo
Tsutomu Ito
Yasunobu Kawachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Shibaura Machine Co Ltd
Original Assignee
Toshiba Corp
Toshiba Machine Co Ltd
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Machine Co Ltd, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55134618A priority Critical patent/JPS5759328A/en
Publication of JPS5759328A publication Critical patent/JPS5759328A/en
Publication of JPS623972B2 publication Critical patent/JPS623972B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To enable to perform accurate and speedy exfoliation by a method wherein a material, having an etching speed faster than that for the developing solution of the resist which was applied on a sample, is used as a bonding agent to be used for fixing the sample on a sample stand. CONSTITUTION:A resist 11 is applied on the upper surface of the sample 10 and the lower surface of which is fixed by bonding on the sample stand 13 through the intermediary of a bonding agent having molecular weight of 100,000 or below. The sample 10 is exposed to an electron beam. The entire sample stand with the sample is soaked in the developing solution and an etching is performed on the bonding agent 12 together with the developing of the resist 11. As the bonding agent 12 is consisted of the PMMA having the molecular weight of 100,000 or below, it is etched by the developing solution at an etching speed faster than that for the exposed section of the resist 11 and an accurate exfoliation can be performed between the sample 10 and the sample stand 13.
JP55134618A 1980-09-27 1980-09-27 Method for fixed exfoliation of sample Granted JPS5759328A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55134618A JPS5759328A (en) 1980-09-27 1980-09-27 Method for fixed exfoliation of sample

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55134618A JPS5759328A (en) 1980-09-27 1980-09-27 Method for fixed exfoliation of sample

Publications (2)

Publication Number Publication Date
JPS5759328A true JPS5759328A (en) 1982-04-09
JPS623972B2 JPS623972B2 (en) 1987-01-28

Family

ID=15132593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55134618A Granted JPS5759328A (en) 1980-09-27 1980-09-27 Method for fixed exfoliation of sample

Country Status (1)

Country Link
JP (1) JPS5759328A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59192834U (en) * 1983-06-09 1984-12-21 富士通株式会社 Substrate holding structure

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63156477U (en) * 1987-04-01 1988-10-13
JPH02163477A (en) * 1988-12-19 1990-06-22 Kayaba Ind Co Ltd Rotary piston pump and motor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318969A (en) * 1976-08-06 1978-02-21 Nippon Telegr & Teleph Corp <Ntt> Wafer fixing method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318969A (en) * 1976-08-06 1978-02-21 Nippon Telegr & Teleph Corp <Ntt> Wafer fixing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59192834U (en) * 1983-06-09 1984-12-21 富士通株式会社 Substrate holding structure

Also Published As

Publication number Publication date
JPS623972B2 (en) 1987-01-28

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