JPS5759328A - Method for fixed exfoliation of sample - Google Patents
Method for fixed exfoliation of sampleInfo
- Publication number
- JPS5759328A JPS5759328A JP55134618A JP13461880A JPS5759328A JP S5759328 A JPS5759328 A JP S5759328A JP 55134618 A JP55134618 A JP 55134618A JP 13461880 A JP13461880 A JP 13461880A JP S5759328 A JPS5759328 A JP S5759328A
- Authority
- JP
- Japan
- Prior art keywords
- sample
- resist
- exfoliation
- bonding agent
- developing solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electron Beam Exposure (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
PURPOSE:To enable to perform accurate and speedy exfoliation by a method wherein a material, having an etching speed faster than that for the developing solution of the resist which was applied on a sample, is used as a bonding agent to be used for fixing the sample on a sample stand. CONSTITUTION:A resist 11 is applied on the upper surface of the sample 10 and the lower surface of which is fixed by bonding on the sample stand 13 through the intermediary of a bonding agent having molecular weight of 100,000 or below. The sample 10 is exposed to an electron beam. The entire sample stand with the sample is soaked in the developing solution and an etching is performed on the bonding agent 12 together with the developing of the resist 11. As the bonding agent 12 is consisted of the PMMA having the molecular weight of 100,000 or below, it is etched by the developing solution at an etching speed faster than that for the exposed section of the resist 11 and an accurate exfoliation can be performed between the sample 10 and the sample stand 13.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55134618A JPS5759328A (en) | 1980-09-27 | 1980-09-27 | Method for fixed exfoliation of sample |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55134618A JPS5759328A (en) | 1980-09-27 | 1980-09-27 | Method for fixed exfoliation of sample |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5759328A true JPS5759328A (en) | 1982-04-09 |
JPS623972B2 JPS623972B2 (en) | 1987-01-28 |
Family
ID=15132593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55134618A Granted JPS5759328A (en) | 1980-09-27 | 1980-09-27 | Method for fixed exfoliation of sample |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5759328A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59192834U (en) * | 1983-06-09 | 1984-12-21 | 富士通株式会社 | Substrate holding structure |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63156477U (en) * | 1987-04-01 | 1988-10-13 | ||
JPH02163477A (en) * | 1988-12-19 | 1990-06-22 | Kayaba Ind Co Ltd | Rotary piston pump and motor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5318969A (en) * | 1976-08-06 | 1978-02-21 | Nippon Telegr & Teleph Corp <Ntt> | Wafer fixing method |
-
1980
- 1980-09-27 JP JP55134618A patent/JPS5759328A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5318969A (en) * | 1976-08-06 | 1978-02-21 | Nippon Telegr & Teleph Corp <Ntt> | Wafer fixing method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59192834U (en) * | 1983-06-09 | 1984-12-21 | 富士通株式会社 | Substrate holding structure |
Also Published As
Publication number | Publication date |
---|---|
JPS623972B2 (en) | 1987-01-28 |
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