JPS575717A - Resin composition for laminatings - Google Patents
Resin composition for laminatingsInfo
- Publication number
- JPS575717A JPS575717A JP8125680A JP8125680A JPS575717A JP S575717 A JPS575717 A JP S575717A JP 8125680 A JP8125680 A JP 8125680A JP 8125680 A JP8125680 A JP 8125680A JP S575717 A JPS575717 A JP S575717A
- Authority
- JP
- Japan
- Prior art keywords
- carboxyls
- epoxy resin
- reaction
- epoxy
- laminatings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010030 laminating Methods 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 abstract 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 3
- 239000005062 Polybutadiene Substances 0.000 abstract 2
- 238000006243 chemical reaction Methods 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 229920002857 polybutadiene Polymers 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 229920001519 homopolymer Polymers 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000007870 radical polymerization initiator Substances 0.000 abstract 1
- 239000011541 reaction mixture Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8125680A JPS575717A (en) | 1980-06-16 | 1980-06-16 | Resin composition for laminatings |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8125680A JPS575717A (en) | 1980-06-16 | 1980-06-16 | Resin composition for laminatings |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS575717A true JPS575717A (en) | 1982-01-12 |
JPS636088B2 JPS636088B2 (enrdf_load_stackoverflow) | 1988-02-08 |
Family
ID=13741296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8125680A Granted JPS575717A (en) | 1980-06-16 | 1980-06-16 | Resin composition for laminatings |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS575717A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS609076A (ja) * | 1983-06-27 | 1985-01-18 | 東芝ケミカル株式会社 | 気密端子 |
JP2003040975A (ja) * | 2001-07-27 | 2003-02-13 | Nippon Soda Co Ltd | エポキシオリゴマーの製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6510728B2 (ja) | 2016-09-15 | 2019-05-08 | 日立建機株式会社 | ダンプトラックのピッチング制御システム |
-
1980
- 1980-06-16 JP JP8125680A patent/JPS575717A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS609076A (ja) * | 1983-06-27 | 1985-01-18 | 東芝ケミカル株式会社 | 気密端子 |
JP2003040975A (ja) * | 2001-07-27 | 2003-02-13 | Nippon Soda Co Ltd | エポキシオリゴマーの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS636088B2 (enrdf_load_stackoverflow) | 1988-02-08 |
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