JPS5750455A - Hybrid integrated circuit - Google Patents

Hybrid integrated circuit

Info

Publication number
JPS5750455A
JPS5750455A JP55125783A JP12578380A JPS5750455A JP S5750455 A JPS5750455 A JP S5750455A JP 55125783 A JP55125783 A JP 55125783A JP 12578380 A JP12578380 A JP 12578380A JP S5750455 A JPS5750455 A JP S5750455A
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit
metal substrate
heat resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55125783A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6231828B2 (https=
Inventor
Kenji Nagashima
Hiroshi Matsumoto
Hiroshi Ohira
Nobuo Iwase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55125783A priority Critical patent/JPS5750455A/ja
Publication of JPS5750455A publication Critical patent/JPS5750455A/ja
Publication of JPS6231828B2 publication Critical patent/JPS6231828B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP55125783A 1980-09-10 1980-09-10 Hybrid integrated circuit Granted JPS5750455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55125783A JPS5750455A (en) 1980-09-10 1980-09-10 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55125783A JPS5750455A (en) 1980-09-10 1980-09-10 Hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS5750455A true JPS5750455A (en) 1982-03-24
JPS6231828B2 JPS6231828B2 (https=) 1987-07-10

Family

ID=14918734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55125783A Granted JPS5750455A (en) 1980-09-10 1980-09-10 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5750455A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193547A (ja) * 1987-02-06 1988-08-10 Showa Denko Kk 回路用基板
JP2011165867A (ja) * 2010-02-09 2011-08-25 Honda Elesys Co Ltd 電子部品ユニット及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55103746A (en) * 1979-01-27 1980-08-08 Lucas Industries Ltd Semiconductor power supply assembly and method of manufacturing same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55103746A (en) * 1979-01-27 1980-08-08 Lucas Industries Ltd Semiconductor power supply assembly and method of manufacturing same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193547A (ja) * 1987-02-06 1988-08-10 Showa Denko Kk 回路用基板
JP2011165867A (ja) * 2010-02-09 2011-08-25 Honda Elesys Co Ltd 電子部品ユニット及びその製造方法
US8737075B2 (en) 2010-02-09 2014-05-27 Honda Elesys Co., Ltd. Electronic component unit and manufacturing method thereof
US9033207B2 (en) 2010-02-09 2015-05-19 Honda Elesys Co., Ltd. Method of manufacturing electronic component unit

Also Published As

Publication number Publication date
JPS6231828B2 (https=) 1987-07-10

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