JPS5749830A - Transmitting device for pressure difference - Google Patents
Transmitting device for pressure differenceInfo
- Publication number
- JPS5749830A JPS5749830A JP12460580A JP12460580A JPS5749830A JP S5749830 A JPS5749830 A JP S5749830A JP 12460580 A JP12460580 A JP 12460580A JP 12460580 A JP12460580 A JP 12460580A JP S5749830 A JPS5749830 A JP S5749830A
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- pressure
- chambers
- sensor
- pressure difference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/02—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
- G01L13/025—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements using diaphragms
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
PURPOSE:To enhance reliability and reproducibility, by welding a plate shaped metal diaphragm which receives fluid pressures from two points in a system to one of members forming pressure chambers, with the welding width similar to the magnitude of the thickness of the diaphragm being provided, and compressing the diaphragm with the other member. CONSTITUTION:A sensor part 100 enclosing a semiconductor pressure difference sensor 101 is communicated to a pressure receiving part 1, with high and low pressure chambers 9 and 10, overload protection chambers 5 and 6, and pressure introducing paths 105 and 106, and high and low sealing parts are formed. Non-compressible silicon oil is filled in the inside. The peripheral parts of the high and low pressure sealing diaphragms 7 and 8 are welded to main bodies 2 and 3. The volumes of the overload protection chambers 5 and 6 are larger than those of the pressure receiving chambers 9 and 10. A diaphragm 4 is not seated by the excessive pressure. The peripheral part of corrosion resisting rolled metal of the central diaphragm 4 is welded to the main body 2, with the welding width similar to the magnitude of the thickness of diaphragm being provided, and compressed by the main body 3. The pressure of the fluid through fluid introducing holes compresses the diaphragm 7 and 8, and the pressure difference is sensed by the sensor 101. In this constitution, the transmitting device characterized by stable zero point and excellent reproducilibity can be formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12460580A JPS5749830A (en) | 1980-09-10 | 1980-09-10 | Transmitting device for pressure difference |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12460580A JPS5749830A (en) | 1980-09-10 | 1980-09-10 | Transmitting device for pressure difference |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5749830A true JPS5749830A (en) | 1982-03-24 |
Family
ID=14889568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12460580A Pending JPS5749830A (en) | 1980-09-10 | 1980-09-10 | Transmitting device for pressure difference |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5749830A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200011359A (en) * | 2018-07-24 | 2020-02-03 | 아즈빌주식회사 | Pressure sensor chip |
-
1980
- 1980-09-10 JP JP12460580A patent/JPS5749830A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200011359A (en) * | 2018-07-24 | 2020-02-03 | 아즈빌주식회사 | Pressure sensor chip |
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