JPS5749248A - Substrate heating and retaining device - Google Patents

Substrate heating and retaining device

Info

Publication number
JPS5749248A
JPS5749248A JP55124819A JP12481980A JPS5749248A JP S5749248 A JPS5749248 A JP S5749248A JP 55124819 A JP55124819 A JP 55124819A JP 12481980 A JP12481980 A JP 12481980A JP S5749248 A JPS5749248 A JP S5749248A
Authority
JP
Japan
Prior art keywords
substrate
base
rod
holes
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55124819A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634702B2 (cg-RX-API-DMAC10.html
Inventor
Junji Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55124819A priority Critical patent/JPS5749248A/ja
Publication of JPS5749248A publication Critical patent/JPS5749248A/ja
Publication of JPS634702B2 publication Critical patent/JPS634702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/78—

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Jigs For Machine Tools (AREA)
  • Surface Heating Bodies (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP55124819A 1980-09-09 1980-09-09 Substrate heating and retaining device Granted JPS5749248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55124819A JPS5749248A (en) 1980-09-09 1980-09-09 Substrate heating and retaining device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55124819A JPS5749248A (en) 1980-09-09 1980-09-09 Substrate heating and retaining device

Publications (2)

Publication Number Publication Date
JPS5749248A true JPS5749248A (en) 1982-03-23
JPS634702B2 JPS634702B2 (cg-RX-API-DMAC10.html) 1988-01-30

Family

ID=14894888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55124819A Granted JPS5749248A (en) 1980-09-09 1980-09-09 Substrate heating and retaining device

Country Status (1)

Country Link
JP (1) JPS5749248A (cg-RX-API-DMAC10.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6053774A (ja) * 1983-09-02 1985-03-27 株式会社日立製作所 基板ベ−ク装置
JPS61168238A (ja) * 1985-01-21 1986-07-29 Fujitsu Ltd 半導体装置の検査装置
JPS62201932U (cg-RX-API-DMAC10.html) * 1986-06-14 1987-12-23
JPS6446930A (en) * 1987-05-30 1989-02-21 Tokyo Electron Ltd Base plate for sample
KR100603239B1 (ko) 2003-09-25 2006-07-20 에스엠시 가부시키가이샤 반도체 기판의 온도조절 장치
WO2014041905A1 (ja) * 2012-09-11 2014-03-20 シャープ株式会社 試験用治具、検査装置、載置装置および試験装置
JP2017041642A (ja) * 2014-12-16 2017-02-23 株式会社東京精密 半導体ウェーハの検査装置及び半導体ウェーハの検査方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49141759U (cg-RX-API-DMAC10.html) * 1973-04-10 1974-12-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49141759U (cg-RX-API-DMAC10.html) * 1973-04-10 1974-12-06

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6053774A (ja) * 1983-09-02 1985-03-27 株式会社日立製作所 基板ベ−ク装置
JPS61168238A (ja) * 1985-01-21 1986-07-29 Fujitsu Ltd 半導体装置の検査装置
JPS62201932U (cg-RX-API-DMAC10.html) * 1986-06-14 1987-12-23
JPS6446930A (en) * 1987-05-30 1989-02-21 Tokyo Electron Ltd Base plate for sample
KR100603239B1 (ko) 2003-09-25 2006-07-20 에스엠시 가부시키가이샤 반도체 기판의 온도조절 장치
WO2014041905A1 (ja) * 2012-09-11 2014-03-20 シャープ株式会社 試験用治具、検査装置、載置装置および試験装置
CN104603626A (zh) * 2012-09-11 2015-05-06 夏普株式会社 试验用夹具、检查装置、载置装置以及试验装置
JPWO2014041905A1 (ja) * 2012-09-11 2016-08-18 シャープ株式会社 試験用治具、検査装置、載置装置および試験装置
JP2017041642A (ja) * 2014-12-16 2017-02-23 株式会社東京精密 半導体ウェーハの検査装置及び半導体ウェーハの検査方法
US9869715B2 (en) 2014-12-16 2018-01-16 Tokyo Seimitsu Co., Ltd. Semiconductor wafer inspection apparatus and semiconductor wafer inspection method

Also Published As

Publication number Publication date
JPS634702B2 (cg-RX-API-DMAC10.html) 1988-01-30

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