JPS5748896A - Entire drive type speaker diaphragm plate and its manufacture - Google Patents
Entire drive type speaker diaphragm plate and its manufactureInfo
- Publication number
- JPS5748896A JPS5748896A JP12385380A JP12385380A JPS5748896A JP S5748896 A JPS5748896 A JP S5748896A JP 12385380 A JP12385380 A JP 12385380A JP 12385380 A JP12385380 A JP 12385380A JP S5748896 A JPS5748896 A JP S5748896A
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm plate
- layer
- manufacture
- drive type
- conductive section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/04—Construction, mounting, or centering of coil
- H04R9/046—Construction
- H04R9/047—Construction in which the windings of the moving coil lay in the same plane
Abstract
PURPOSE:To make small the peak and dip of the frequency characteristics, to make flat the high frequency sound and to increase the strength of a diaphragm plate, by forming a voice coil to a conductive section through the forming of the conductive part in implanted state, to a diaphragm plate base formed of metal. CONSTITUTION:A conductive section 2 made of Al as a voice coil in spiral which produces a drive force on the entire surface of a metal made diaphragm plate base 1 is formed in implanting state via an insulation layer 3. In manufacturing this diaphragm plate, an Al layer 12 is formed on a copper-made foil plate 11 with vapor deposition, and the Al layer 12 is provided with a resist layer in spiral, and etching processing is made for the Al 12 to form a conductive section 12a. An insulation layer 12b is formed on the exposed surface of the section 12a through alumite processing, and a beryllium 13 is vapor deposited on the 12a to form the base 1. Finally, the foil plate 11 is removed through etching processing, to form the diaphragm plate with flat high frequency sound.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12385380A JPS5748896A (en) | 1980-09-05 | 1980-09-05 | Entire drive type speaker diaphragm plate and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12385380A JPS5748896A (en) | 1980-09-05 | 1980-09-05 | Entire drive type speaker diaphragm plate and its manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5748896A true JPS5748896A (en) | 1982-03-20 |
JPS6232680B2 JPS6232680B2 (en) | 1987-07-16 |
Family
ID=14871010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12385380A Granted JPS5748896A (en) | 1980-09-05 | 1980-09-05 | Entire drive type speaker diaphragm plate and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5748896A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112292871A (en) * | 2018-08-06 | 2021-01-29 | 华为技术有限公司 | Printed wiring board for electronic device and electronic device including the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5556799A (en) * | 1978-10-20 | 1980-04-25 | Sanyo Electric Co Ltd | Manufacture of voice coil |
-
1980
- 1980-09-05 JP JP12385380A patent/JPS5748896A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5556799A (en) * | 1978-10-20 | 1980-04-25 | Sanyo Electric Co Ltd | Manufacture of voice coil |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112292871A (en) * | 2018-08-06 | 2021-01-29 | 华为技术有限公司 | Printed wiring board for electronic device and electronic device including the same |
CN112292871B (en) * | 2018-08-06 | 2021-12-28 | 华为技术有限公司 | Electronic device including improved printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
JPS6232680B2 (en) | 1987-07-16 |
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