JPS6232680B2 - - Google Patents

Info

Publication number
JPS6232680B2
JPS6232680B2 JP55123853A JP12385380A JPS6232680B2 JP S6232680 B2 JPS6232680 B2 JP S6232680B2 JP 55123853 A JP55123853 A JP 55123853A JP 12385380 A JP12385380 A JP 12385380A JP S6232680 B2 JPS6232680 B2 JP S6232680B2
Authority
JP
Japan
Prior art keywords
diaphragm
voice coil
layer
substrate
highly conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55123853A
Other languages
Japanese (ja)
Other versions
JPS5748896A (en
Inventor
Takashi Ooyaba
Katsumi Kinoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Electronic Corp filed Critical Pioneer Electronic Corp
Priority to JP12385380A priority Critical patent/JPS5748896A/en
Publication of JPS5748896A publication Critical patent/JPS5748896A/en
Publication of JPS6232680B2 publication Critical patent/JPS6232680B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • H04R9/04Construction, mounting, or centering of coil
    • H04R9/046Construction
    • H04R9/047Construction in which the windings of the moving coil lay in the same plane

Description

【発明の詳細な説明】 この発明は全面駆動型スピーカ用振動板、およ
び、その製造方法に関し、さらに詳しくは、振動
板基板中に良導電性金属によるボイスコイル部を
埋設形成した全面駆動型スピーカ用振動板に関す
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a diaphragm for a full-plane drive type speaker and a method for manufacturing the same. Regarding diaphragms for use.

全面駆動型スピーカに用いられている駆動板は
ポリイミド、ポリアミドなどのプラスチツクフイ
ルムにアルミニウム箔層をラミネート形成、ある
いは、蒸着形成し、このアルミニウム箔層をコイ
ル状に残るようにエツチング加工を施したもの
で、比較的耐熱性の高いポリイミド、ポリアミド
であつても耐熱限界は300℃位で、他のプラスチ
ツクフイルムはそれ以下であり、強度も弱いため
に高域音がフラツトに表現できない問題がある。
The drive plate used in full-drive speakers is made by laminating or vapor depositing an aluminum foil layer on a plastic film made of polyimide, polyamide, etc., and then etching the aluminum foil layer so that it remains in a coil shape. Even with polyimide and polyamide, which have relatively high heat resistance, the heat resistance limit is around 300 degrees Celsius, while other plastic films have a lower heat resistance, and their strength is also weak, making it difficult to express high-frequency sounds flatly.

そこで、この発明は振動板の基板をプラスチツ
クフイルムでなくベリリウムで代表される低密
度、高剛性の金属により形成し、ボイスコイルと
しての金属導電部を埋設状態で設けることにより
振動板自体の特性を向上させるようにし、さら
に、これを能率的に製造し得るようにしたもの
で、そのために、振動板基板中にボイスコイルを
形成する導電部を埋設状に形成し、基板の特性に
併せて導電部の特性により低密度にして、かつ、
高剛性の振動板を構成したことを特徴とするもの
である。
Therefore, in this invention, the substrate of the diaphragm is made of a low-density, high-rigidity metal such as beryllium instead of a plastic film, and the characteristics of the diaphragm itself are improved by embedding a metal conductive part as a voice coil. Furthermore, the conductive part that forms the voice coil is buried in the diaphragm substrate, and the conductive part that forms the voice coil is embedded in the diaphragm substrate. Low density depending on the characteristics of the part, and
It is characterized by a highly rigid diaphragm.

以下、この発明の詳細を添付した図面に沿つて
説明する。先ず、第1図はこの発明による振動板
の平面図であつて、ベリリウムで代表される低密
度、高弾性高剛性の金属製の振動板基板1に対し
て、その全面に駆動力が発生するように渦巻状に
ボイスコイル部としてのアルミニウムの導電部2
が絶縁層3を介して埋込み状態で形成されてい
る。
Hereinafter, details of the present invention will be explained with reference to the accompanying drawings. First, FIG. 1 is a plan view of a diaphragm according to the present invention, in which a driving force is generated on the entire surface of a diaphragm substrate 1 made of a low-density, high-elasticity, and high-rigidity metal such as beryllium. Aluminum conductive part 2 as a voice coil part in a spiral shape
is formed in a buried state through the insulating layer 3.

このような構成の振動板は、第2図においてそ
の製造工程が示されているようにして製造されて
いる。即ち、銅製の箔板11にアルミニウム層1
2が蒸着、あるいは、貼合せによつて形成されて
いて(第2図<A>)、このアルミニウム層12
に渦巻状のレジスト層を層設して、このアルミニ
ウム層12にエツチング加工を施し、アルミニウ
ム層12による導電部12aを形成する(第2図
<B>)。この導電部12aの露出表面にアルマ
イト処理による絶縁層12bを形成する(第2図
<C>)。そして、導電部12a側に対してベリ
リウム13を蒸着して、振動板基板1を形成する
(第2図<D>)。この振動板基板1は一表面は平
滑面であり、かつ、他表面は絶縁層12bで被わ
れた導電部12aが振動板基板中に埋設状態にな
つている。
The diaphragm having such a structure is manufactured as shown in the manufacturing process shown in FIG. That is, an aluminum layer 1 is placed on a copper foil plate 11.
2 is formed by vapor deposition or lamination (Fig. 2 <A>), and this aluminum layer 12
A spiral resist layer is formed on the aluminum layer 12, and the aluminum layer 12 is etched to form a conductive portion 12a of the aluminum layer 12 (FIG. 2B). An insulating layer 12b is formed on the exposed surface of the conductive portion 12a by alumite treatment (FIG. 2<C>). Then, beryllium 13 is deposited on the conductive portion 12a side to form the diaphragm substrate 1 (FIG. 2<D>). One surface of this diaphragm substrate 1 is a smooth surface, and the other surface is covered with an insulating layer 12b and a conductive portion 12a is embedded in the diaphragm substrate.

最後に、銅製の箔板11をエツチング加工によ
り除去し、振動板基板1に導電部2が絶縁層3を
介して埋込まれた状態の全面駆動型のスピーカ用
振動板を得る(第2図<E>)。
Finally, the copper foil plate 11 is removed by etching to obtain a fully driven speaker diaphragm in which the conductive portion 2 is embedded in the diaphragm substrate 1 via the insulating layer 3 (see Fig. 2). <E>).

以上の説明から明らかなように、この発明の全
面駆動型のスピーカ用振動板は、金属により成形
された振動板基板中に少なくとも3面が絶縁層で
囲まれて導電部を埋設状態に形成した構成である
から、金属の薄膜状の基板が直接振動板を形成
し、これによりプラスチツクフイルムを用いた振
動板に比較して周波数特性におけるピーク,デイ
ツプが小さくなりフラツトな特性が得られると共
に、導電部よりの発熱が金属の振動板基板を介し
て放熱されるため放熱効果が大きく、また振動板
強度が増加して耐久入力も向上する。また、振動
板基板を薄くできるのでプラスチツク製の振動板
に比較して重量が軽く、感度もよく、さらには、
導電部も振動板の一部を形成しているので、複合
振動板となつて分割振動の抑制、加えて、耐熱性
の向上ができる。
As is clear from the above description, the full-plane drive type speaker diaphragm of the present invention includes a diaphragm substrate formed of metal, surrounded by insulating layers on at least three sides, and having a conductive portion embedded therein. Because of its structure, the metal thin film substrate directly forms the diaphragm, which results in smaller peaks and dips in frequency characteristics compared to diaphragms using plastic film, and provides flat characteristics. Since the heat generated by the diaphragm is radiated through the metal diaphragm substrate, the heat radiating effect is large, and the diaphragm strength is increased, resulting in improved input durability. In addition, since the diaphragm substrate can be made thinner, it is lighter in weight and has better sensitivity than a plastic diaphragm.
Since the conductive portion also forms a part of the diaphragm, it becomes a composite diaphragm, which suppresses split vibration and improves heat resistance.

また、その振動板は、銅製の箔板に良導電性金
属層を層設し、この良導電性金属によるボイスコ
イル部に相当する部分にレジスト層を設け、他の
部分をエツチング加工により除去し、さらに、ボ
イスコイル部の露出表面にアルマイト処理による
絶縁層を形成し、この絶縁層側に振動板に適した
金属層を蒸着して箔板を除去して振動板を得るの
で、容易に、かつ、正確で能率的に製造できる。
In addition, the diaphragm is made by layering a highly conductive metal layer on a copper foil plate, providing a resist layer on the portion of this highly conductive metal that corresponds to the voice coil, and removing other portions by etching. Furthermore, an insulating layer is formed by alumite treatment on the exposed surface of the voice coil section, a metal layer suitable for the diaphragm is deposited on the insulating layer side, and the foil plate is removed to obtain the diaphragm, so that the diaphragm can be easily obtained. Moreover, it can be manufactured accurately and efficiently.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明による振動板の平面図、第2
図はこの発明による製造方法の工程を示す断面説
明図である。 1…振動板基板、2…導電部、3…絶縁部、1
1…箔板、12…アルミニウム層、12a…導電
部、12b…絶縁層、13…ベリリウム。
FIG. 1 is a plan view of a diaphragm according to the present invention, and FIG.
The figure is a cross-sectional explanatory view showing the steps of the manufacturing method according to the present invention. 1... Vibration plate substrate, 2... Conductive part, 3... Insulating part, 1
DESCRIPTION OF SYMBOLS 1... Foil plate, 12... Aluminum layer, 12a... Conductive part, 12b... Insulating layer, 13... Beryllium.

Claims (1)

【特許請求の範囲】 1 低密度、高弾性高剛性の金属による振動板基
板と、この振動板基板中に少なくとも、3面が絶
縁層で囲まれて埋設状態で形成された導電部によ
るボイスコイル部とを備える全面駆動型スピーカ
用振動板。 2 銅製の箔板に良導電性金属層を層設し、この
良導電性金属層にボイスコイル形状にレジスト層
を設けて、他の部分にエツチング加工を施して良
導電性金属層によるボイスコイル部を形成し、こ
のボイスコイル部の露出表面にアルマイト処理に
よる絶縁層を設けた後、絶縁層側に振動板基板と
なる低密度、高弾性高剛性金属を蒸着してから箔
板をエツチングにより除去して振動板とする全面
駆動型スピーカ用振動板の製造方法。
[Scope of Claims] 1. A voice coil consisting of a diaphragm substrate made of a low-density, high-elasticity, and high-rigidity metal, and a conductive portion embedded in the diaphragm substrate and surrounded by insulating layers on at least three sides. A diaphragm for a full-plane drive type speaker, comprising: 2 A highly conductive metal layer is layered on a copper foil plate, a resist layer is provided in the shape of a voice coil on this highly conductive metal layer, and other parts are etched to form a voice coil made of the highly conductive metal layer. After forming an insulating layer by alumite treatment on the exposed surface of this voice coil part, a low-density, high-elasticity, high-rigidity metal that will become the diaphragm substrate is vapor-deposited on the insulating layer side, and then the foil plate is etched. A method of manufacturing a diaphragm for a full-plane drive type speaker, which is removed and used as a diaphragm.
JP12385380A 1980-09-05 1980-09-05 Entire drive type speaker diaphragm plate and its manufacture Granted JPS5748896A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12385380A JPS5748896A (en) 1980-09-05 1980-09-05 Entire drive type speaker diaphragm plate and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12385380A JPS5748896A (en) 1980-09-05 1980-09-05 Entire drive type speaker diaphragm plate and its manufacture

Publications (2)

Publication Number Publication Date
JPS5748896A JPS5748896A (en) 1982-03-20
JPS6232680B2 true JPS6232680B2 (en) 1987-07-16

Family

ID=14871010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12385380A Granted JPS5748896A (en) 1980-09-05 1980-09-05 Entire drive type speaker diaphragm plate and its manufacture

Country Status (1)

Country Link
JP (1) JPS5748896A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020030239A1 (en) * 2018-08-06 2020-02-13 Huawei Technologies Co., Ltd. Printed wiring board for an electronic device and electronic device comprising said printed wiring board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5556799A (en) * 1978-10-20 1980-04-25 Sanyo Electric Co Ltd Manufacture of voice coil

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5556799A (en) * 1978-10-20 1980-04-25 Sanyo Electric Co Ltd Manufacture of voice coil

Also Published As

Publication number Publication date
JPS5748896A (en) 1982-03-20

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