JPS5745983A - Manufacture of solid state light emitting indicator - Google Patents

Manufacture of solid state light emitting indicator

Info

Publication number
JPS5745983A
JPS5745983A JP12189080A JP12189080A JPS5745983A JP S5745983 A JPS5745983 A JP S5745983A JP 12189080 A JP12189080 A JP 12189080A JP 12189080 A JP12189080 A JP 12189080A JP S5745983 A JPS5745983 A JP S5745983A
Authority
JP
Japan
Prior art keywords
pellets
projections
light emitting
solid state
state light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12189080A
Other languages
Japanese (ja)
Other versions
JPS6134272B2 (en
Inventor
Ikuo Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12189080A priority Critical patent/JPS5745983A/en
Publication of JPS5745983A publication Critical patent/JPS5745983A/en
Publication of JPS6134272B2 publication Critical patent/JPS6134272B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To improve the assembling efficiency of and the reliability of a solid state light emitting indicator by forming a conductive projection on the electrodes of each LED pellet, filling insulating material between the pellets and connecting between the pellets on the planar surface. CONSTITUTION:A metallic film 12 is deposited on the P type surface of an LED water 11. After a mask material 14 is then coated on the overall surface, holes 15a-15c are opened, and conductive projections 16 are respectively formed in the holes 15a-15c. With the projections 16 as mask material the film 12 is selectively removed. After the wafer 11 is then divided into individual pellets, the LEDs thus divided are secured at the predetermined positions on the substrate 17. Then, a light transmission insulating material 20 is then filled and cured between the pellets. The material 20 is then lapped from the surface side, the surface of the material 20 is smoothened, and the projections 16 of all the pellets are uniformly exposed. After the surface of the material 20 is deposited with a metallic film 21, it is wired as prescribed, it is wired between the projections 16, thereby wiring the anodes of the dot matrix.
JP12189080A 1980-09-03 1980-09-03 Manufacture of solid state light emitting indicator Granted JPS5745983A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12189080A JPS5745983A (en) 1980-09-03 1980-09-03 Manufacture of solid state light emitting indicator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12189080A JPS5745983A (en) 1980-09-03 1980-09-03 Manufacture of solid state light emitting indicator

Publications (2)

Publication Number Publication Date
JPS5745983A true JPS5745983A (en) 1982-03-16
JPS6134272B2 JPS6134272B2 (en) 1986-08-06

Family

ID=14822432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12189080A Granted JPS5745983A (en) 1980-09-03 1980-09-03 Manufacture of solid state light emitting indicator

Country Status (1)

Country Link
JP (1) JPS5745983A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4432131A (en) * 1981-09-22 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing display device
JPS62160563U (en) * 1986-03-31 1987-10-13
WO1997028565A1 (en) * 1996-01-31 1997-08-07 Siemens Aktiengesellschaft Led matrix
US6087680A (en) * 1997-01-31 2000-07-11 Siemens Aktiengesellschaft Led device
JP2006147876A (en) * 2004-11-19 2006-06-08 Sony Corp Semiconductor light-emitting device, manufacturing method therefor, and manufacturing method for image display device
WO2011111516A1 (en) * 2010-03-12 2011-09-15 シャープ株式会社 Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device
JP2011192722A (en) * 2010-03-12 2011-09-29 Sharp Corp Method of manufacturing light emitting device
JP2015525001A (en) * 2012-08-15 2015-08-27 晶元光▲電▼股▲ふん▼有限公司 Light emitting parts
JP2019153662A (en) * 2018-03-02 2019-09-12 日亜化学工業株式会社 Light emitting device and manufacturing method thereof

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4432131A (en) * 1981-09-22 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing display device
JPS62160563U (en) * 1986-03-31 1987-10-13
WO1997028565A1 (en) * 1996-01-31 1997-08-07 Siemens Aktiengesellschaft Led matrix
US6087680A (en) * 1997-01-31 2000-07-11 Siemens Aktiengesellschaft Led device
JP2006147876A (en) * 2004-11-19 2006-06-08 Sony Corp Semiconductor light-emitting device, manufacturing method therefor, and manufacturing method for image display device
JP4617846B2 (en) * 2004-11-19 2011-01-26 ソニー株式会社 Semiconductor light emitting device, manufacturing method thereof, and manufacturing method of image display device
WO2011111516A1 (en) * 2010-03-12 2011-09-15 シャープ株式会社 Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device
JP2011192722A (en) * 2010-03-12 2011-09-29 Sharp Corp Method of manufacturing light emitting device
US9329433B2 (en) 2010-03-12 2016-05-03 Sharp Kabushiki Kaisha Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device
JP2015525001A (en) * 2012-08-15 2015-08-27 晶元光▲電▼股▲ふん▼有限公司 Light emitting parts
JP2019153662A (en) * 2018-03-02 2019-09-12 日亜化学工業株式会社 Light emitting device and manufacturing method thereof

Also Published As

Publication number Publication date
JPS6134272B2 (en) 1986-08-06

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