JPS5742175A - Infrared ray detector - Google Patents
Infrared ray detectorInfo
- Publication number
- JPS5742175A JPS5742175A JP55117920A JP11792080A JPS5742175A JP S5742175 A JPS5742175 A JP S5742175A JP 55117920 A JP55117920 A JP 55117920A JP 11792080 A JP11792080 A JP 11792080A JP S5742175 A JPS5742175 A JP S5742175A
- Authority
- JP
- Japan
- Prior art keywords
- infrared ray
- assembly
- bumps
- regions
- ray detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 238000001514 detection method Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Abstract
PURPOSE:To obtain an highly sensitive device by having incoming infrared ray reaching a photoelectric convertion region of a detection element through a concave section provided on the back thereof in an infrared ray detector in which the infrared ray detecting element is integrated with a circuit element for processing the output signal thereof. CONSTITUTION:An SiO2 film 3 covers the surface of an integrated circuit element 2 made up of an Si substrate 20 having a plurality of active regions 21-24 and after windows are etched on the regions 21-24, columnar bumps 4a-4d comprising a low melting point such as In are mounted on the regions 21-24. Then, a plurality of mesa tops 11-14 provided on the rear surface of an assembly of infrared ray detecting element are fastened on the top of the bumps so that the assembly 1 is mechanically and chemically combined with the elements 2 through the bumps 4a-4d. Concave sections 31-34 are engraved on the back of the assembly corresponding to reverse conducting type layers 11a-14a provided in the mesa tops 11-14 of the assembly 1. Infrared rays is made incident to the concave sections while the majority of the infrared rays is contributed to the signals.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55117920A JPS5742175A (en) | 1980-08-26 | 1980-08-26 | Infrared ray detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55117920A JPS5742175A (en) | 1980-08-26 | 1980-08-26 | Infrared ray detector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5742175A true JPS5742175A (en) | 1982-03-09 |
Family
ID=14723443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55117920A Pending JPS5742175A (en) | 1980-08-26 | 1980-08-26 | Infrared ray detector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5742175A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4752816A (en) * | 1983-04-05 | 1988-06-21 | Plessey Overseas Limited | Electronic component |
JPH07193268A (en) * | 1991-10-30 | 1995-07-28 | At & T Corp | Quantum well light receiving device |
US6537855B2 (en) * | 1999-04-28 | 2003-03-25 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method of manufacturing the same |
WO2004086504A1 (en) | 2003-03-27 | 2004-10-07 | Hamamatsu Photonics K.K. | Photodiode array and production method thereof, and radiation detector |
EP1608021A1 (en) * | 2003-03-27 | 2005-12-21 | Hamamatsu Photonics K.K. | Photodiode array and production method thereof, and radiation detector |
-
1980
- 1980-08-26 JP JP55117920A patent/JPS5742175A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4752816A (en) * | 1983-04-05 | 1988-06-21 | Plessey Overseas Limited | Electronic component |
JPH07193268A (en) * | 1991-10-30 | 1995-07-28 | At & T Corp | Quantum well light receiving device |
US6537855B2 (en) * | 1999-04-28 | 2003-03-25 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method of manufacturing the same |
WO2004086504A1 (en) | 2003-03-27 | 2004-10-07 | Hamamatsu Photonics K.K. | Photodiode array and production method thereof, and radiation detector |
EP1608021A1 (en) * | 2003-03-27 | 2005-12-21 | Hamamatsu Photonics K.K. | Photodiode array and production method thereof, and radiation detector |
EP1608020A1 (en) * | 2003-03-27 | 2005-12-21 | Hamamatsu Photonics K.K. | Photodiode array and production method thereof, and radiation detector |
EP1608020A4 (en) * | 2003-03-27 | 2007-04-18 | Hamamatsu Photonics Kk | Photodiode array and production method thereof, and radiation detector |
EP1608021A4 (en) * | 2003-03-27 | 2007-05-02 | Hamamatsu Photonics Kk | Photodiode array and production method thereof, and radiation detector |
US7408238B2 (en) | 2003-03-27 | 2008-08-05 | Hamamatsu Photonics K.K. | Photodiode array and production method thereof, and radiation detector |
US7888766B2 (en) | 2003-03-27 | 2011-02-15 | Hamamatsu Photonics K.K. | Photodiode array and radiation detector having depressions of predetermined depth formed in regions corresponding to the regions where the photodiodes are formed in the semiconductor substrate |
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