JPS5740947A - Ball bonding for wire - Google Patents

Ball bonding for wire

Info

Publication number
JPS5740947A
JPS5740947A JP10072281A JP10072281A JPS5740947A JP S5740947 A JPS5740947 A JP S5740947A JP 10072281 A JP10072281 A JP 10072281A JP 10072281 A JP10072281 A JP 10072281A JP S5740947 A JPS5740947 A JP S5740947A
Authority
JP
Japan
Prior art keywords
wire
ball
forming
low
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10072281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6362098B2 (enExample
Inventor
Daburiyu Kaataa Arubaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Welding Institute England
Original Assignee
Welding Institute England
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Welding Institute England filed Critical Welding Institute England
Publication of JPS5740947A publication Critical patent/JPS5740947A/ja
Publication of JPS6362098B2 publication Critical patent/JPS6362098B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/45169—Platinum (Pt) as principal constituent
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07168—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/07541—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP10072281A 1980-06-30 1981-06-30 Ball bonding for wire Granted JPS5740947A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8021382 1980-06-30

Publications (2)

Publication Number Publication Date
JPS5740947A true JPS5740947A (en) 1982-03-06
JPS6362098B2 JPS6362098B2 (enExample) 1988-12-01

Family

ID=10514418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10072281A Granted JPS5740947A (en) 1980-06-30 1981-06-30 Ball bonding for wire

Country Status (4)

Country Link
US (1) US4459452A (enExample)
EP (1) EP0043692B1 (enExample)
JP (1) JPS5740947A (enExample)
DE (1) DE3162649D1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61231726A (ja) * 1985-04-05 1986-10-16 Mitsubishi Electric Corp ワイヤボンデイング用ボ−ルの形成方法
JPH02135746A (ja) * 1988-11-17 1990-05-24 Marine Instr Co Ltd ボール形成装置及びそのワイヤ切れ検知方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0061852A3 (en) * 1981-03-30 1983-08-24 Texas Instruments Incorporated Self starting current controlled discharge bonding wire ball maker
FR2522629B1 (fr) * 1982-03-02 1986-12-05 Centre Nat Rech Scient Procede et dispositif de prehension et de transfert individuel de pieces
JPS58154241A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置及びその製法
EP0348018B1 (en) * 1982-03-10 1999-05-19 Hitachi, Ltd. Method of manufacture of a resin encapsulated semiconductor device
US4476366A (en) * 1983-02-01 1984-10-09 Fairchild Camera & Instrument Corp. Controlled bonding wire ball formation
US4572772A (en) * 1983-11-07 1986-02-25 Texas Instruments Incorporated Method for cleaning an electrode
US4523071A (en) * 1984-05-14 1985-06-11 Hughes Aircraft Company Method and apparatus for forming a ball at the end of a wire
CH666425A5 (de) * 1984-12-24 1988-07-29 Gamper & Co Ag Verfahren und vorrichtung zur herstellung von bindedraehten zum binden von gebuendelten gegenstaenden.
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
GB9100225D0 (en) * 1991-01-05 1991-02-20 Emhart Inc Bonding head
RU2120362C1 (ru) * 1996-05-05 1998-10-20 Военный инженерно-технический университет Устройство для сварки
WO2001097256A2 (en) * 2000-06-13 2001-12-20 Asm Technology Singapore Pte Ltd. A method of and apparatus for monitoring a ball forming process

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2759088A (en) * 1951-07-07 1956-08-14 Baker & Co Inc Method of rounding wire end
US3241218A (en) * 1962-01-05 1966-03-22 New Twist Connector Corp Method of fabricating pin connectors
GB1142206A (en) * 1965-05-04 1969-02-05 Welding Inst Improvements in or relating to power sources for electric arc stabilisation
FR2063196A5 (en) * 1969-09-02 1971-07-09 Radiotechnique Compelec Fusion cutting thin filaments for semiconductor welding
CA1020236A (en) * 1974-01-28 1977-11-01 Continental Can Company Arc welding system having main power and ignition power sources
CH568656A5 (en) * 1974-03-20 1975-10-31 Transistor Ag Welding of contact blobs to semiconductor lead wires - uses electric DC light arc of preset current strength for melting lead wire end
US3934108A (en) * 1974-09-16 1976-01-20 Uthe Technology, Inc. Lead bonding method and apparatus
DE2459289A1 (de) * 1974-12-14 1976-06-16 Messer Griesheim Gmbh Einrichtung zum lichtbogenschweissen, plasmaschweissen und/oder schneiden
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus
DE2746803C2 (de) * 1977-10-18 1986-08-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Trennen eines aus einer Vielzahl von Drähten bestehenden Seiles
DE2944608A1 (de) * 1979-11-05 1981-05-07 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum lichtbogenschweissen mit vorgegebener stromcharakteristik

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61231726A (ja) * 1985-04-05 1986-10-16 Mitsubishi Electric Corp ワイヤボンデイング用ボ−ルの形成方法
JPH02135746A (ja) * 1988-11-17 1990-05-24 Marine Instr Co Ltd ボール形成装置及びそのワイヤ切れ検知方法

Also Published As

Publication number Publication date
US4459452A (en) 1984-07-10
EP0043692A3 (en) 1982-01-20
JPS6362098B2 (enExample) 1988-12-01
EP0043692A2 (en) 1982-01-13
DE3162649D1 (en) 1984-04-19
EP0043692B1 (en) 1984-03-14

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