JPS5736836A - Pellet bonder - Google Patents

Pellet bonder

Info

Publication number
JPS5736836A
JPS5736836A JP11170980A JP11170980A JPS5736836A JP S5736836 A JPS5736836 A JP S5736836A JP 11170980 A JP11170980 A JP 11170980A JP 11170980 A JP11170980 A JP 11170980A JP S5736836 A JPS5736836 A JP S5736836A
Authority
JP
Japan
Prior art keywords
pellet
axis
arm
collet
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11170980A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6259460B2 (OSRAM
Inventor
Yoshiyuki Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11170980A priority Critical patent/JPS5736836A/ja
Publication of JPS5736836A publication Critical patent/JPS5736836A/ja
Publication of JPS6259460B2 publication Critical patent/JPS6259460B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/073
    • H10W70/682
    • H10W72/07141
    • H10W72/07337

Landscapes

  • Die Bonding (AREA)
JP11170980A 1980-08-15 1980-08-15 Pellet bonder Granted JPS5736836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11170980A JPS5736836A (en) 1980-08-15 1980-08-15 Pellet bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11170980A JPS5736836A (en) 1980-08-15 1980-08-15 Pellet bonder

Publications (2)

Publication Number Publication Date
JPS5736836A true JPS5736836A (en) 1982-02-27
JPS6259460B2 JPS6259460B2 (OSRAM) 1987-12-11

Family

ID=14568163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11170980A Granted JPS5736836A (en) 1980-08-15 1980-08-15 Pellet bonder

Country Status (1)

Country Link
JP (1) JPS5736836A (OSRAM)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60227430A (ja) * 1984-04-26 1985-11-12 Nec Kyushu Ltd 半導体素子の固定装置
JPS60185335U (ja) * 1984-05-21 1985-12-09 新日本無線株式会社 半導体チツプの接着装置
JPS615531A (ja) * 1984-06-20 1986-01-11 Akita Denshi Kk 半導体組立装置
JPH031478A (ja) * 1989-05-29 1991-01-08 Mitsubishi Heavy Ind Ltd インバータ方式加熱用電源装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056877A (OSRAM) * 1973-09-14 1975-05-17
JPS53124067A (en) * 1976-10-29 1978-10-30 Hitachi Ltd Pellet bonding method
JPS56103431A (en) * 1980-01-22 1981-08-18 Shinkawa Ltd Scrubbing for diebonder

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056877A (OSRAM) * 1973-09-14 1975-05-17
JPS53124067A (en) * 1976-10-29 1978-10-30 Hitachi Ltd Pellet bonding method
JPS56103431A (en) * 1980-01-22 1981-08-18 Shinkawa Ltd Scrubbing for diebonder

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60227430A (ja) * 1984-04-26 1985-11-12 Nec Kyushu Ltd 半導体素子の固定装置
JPS60185335U (ja) * 1984-05-21 1985-12-09 新日本無線株式会社 半導体チツプの接着装置
JPS615531A (ja) * 1984-06-20 1986-01-11 Akita Denshi Kk 半導体組立装置
JPH031478A (ja) * 1989-05-29 1991-01-08 Mitsubishi Heavy Ind Ltd インバータ方式加熱用電源装置

Also Published As

Publication number Publication date
JPS6259460B2 (OSRAM) 1987-12-11

Similar Documents

Publication Publication Date Title
US3813022A (en) Wire bonder apparatus
GB1071648A (en) Position control device
JPS5736836A (en) Pellet bonder
JPS5753950A (en) Pellet bonding device
KR100445530B1 (ko) 반도체장치
DE3460657D1 (en) Gripper for industrial robots
FR2479641B1 (OSRAM)
GB939762A (en) Method and apparatus for assembling a semi-conductor device
JPH0127577B2 (OSRAM)
EP0251814A3 (en) Engraving machine
JPS6441231A (en) Die bonder
JPS56103429A (en) Die bonder
JPH0239840U (OSRAM)
JPS57124446A (en) Die bond apparatus
JPS56103430A (en) Die bonder
JPS57135734A (en) Numerically controlled cutting machine for glass plate
JPH0223025B2 (OSRAM)
JPS5411578A (en) Device for controlling the position of a fixture for use in automatic assembling machines
JPS55162238A (en) Semiconductor pellet fitting device
JPS5745936A (en) Feeding device for semiconductor substrate
JPS56103431A (en) Scrubbing for diebonder
JPS5526128A (en) Device for carrying workpiece
JPS59175438U (ja) ワ−ク供給装置
JPH03116232U (OSRAM)
GB1068122A (en) Improvements in electric welding device