JPS5736111A - Preparation of prepreg - Google Patents

Preparation of prepreg

Info

Publication number
JPS5736111A
JPS5736111A JP11151780A JP11151780A JPS5736111A JP S5736111 A JPS5736111 A JP S5736111A JP 11151780 A JP11151780 A JP 11151780A JP 11151780 A JP11151780 A JP 11151780A JP S5736111 A JPS5736111 A JP S5736111A
Authority
JP
Japan
Prior art keywords
pref
prepreg
solvent
self
softening point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11151780A
Other languages
Japanese (ja)
Inventor
Taketoshi Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Petrochemical Co Ltd
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Priority to JP11151780A priority Critical patent/JPS5736111A/en
Publication of JPS5736111A publication Critical patent/JPS5736111A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

PURPOSE: To prepare a prepreg having excellent transportability and low surface tackiness, and especially suitable as a printed circuit board for computer, by impregnating reinforcing fibers with a varnish containing a self-curing resin having a softening point of ≥50°C.
CONSTITUTION: The objective prepreg is prepared by (1) impregnating reinforcing fibers with a varnish having a viscosity of 50W500CPS at 20°C and composed of (A) 100pts.wt. of a self-curing resin having a softening point of ≥50°C and obtained by reacting (i) a polyepoxy compound (esp. the one having an epoxy equivalent of 100W1,000) and (ii) an unsaturated monobasic acid (e.g. acrylic acid), (B) (pref. 0.5W2pts.wt. of) a radical polymerization initiator (pref. lauroyl peroxide, etc.), and (C) (pref. 50W200pts.wt. of) a noncrosslinkable solvent (e.g. benzene), and (2) removing the solvent by heating and drying.
COPYRIGHT: (C)1982,JPO&Japio
JP11151780A 1980-08-13 1980-08-13 Preparation of prepreg Pending JPS5736111A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11151780A JPS5736111A (en) 1980-08-13 1980-08-13 Preparation of prepreg

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11151780A JPS5736111A (en) 1980-08-13 1980-08-13 Preparation of prepreg

Publications (1)

Publication Number Publication Date
JPS5736111A true JPS5736111A (en) 1982-02-26

Family

ID=14563317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11151780A Pending JPS5736111A (en) 1980-08-13 1980-08-13 Preparation of prepreg

Country Status (1)

Country Link
JP (1) JPS5736111A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6341519A (en) * 1986-08-07 1988-02-22 Dia Furotsuku Kk Heat-resistant resin impregnant composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6341519A (en) * 1986-08-07 1988-02-22 Dia Furotsuku Kk Heat-resistant resin impregnant composition

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