JPS5735356A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5735356A
JPS5735356A JP11123880A JP11123880A JPS5735356A JP S5735356 A JPS5735356 A JP S5735356A JP 11123880 A JP11123880 A JP 11123880A JP 11123880 A JP11123880 A JP 11123880A JP S5735356 A JPS5735356 A JP S5735356A
Authority
JP
Japan
Prior art keywords
foil
tape
semiconductor chip
polyimide
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11123880A
Other languages
Japanese (ja)
Inventor
Tsutomu Akatsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11123880A priority Critical patent/JPS5735356A/en
Publication of JPS5735356A publication Critical patent/JPS5735356A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3164—Partial encapsulation or coating the coating being a foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To protect against radiation emitted from a semiconductor container and the like by covering the surface of a semiconductor chip by polyimide foil. CONSTITUTION:The semiconductor chip 1 is set at a specified position of the die- bonded semiconductor container 2. The tape shaped polyimide foil 3 is prepared at the side of said position. The polymide foil tape 3 is cut with a cutter 4, and supplied on a table 5. Polyimide series bonding agent is applied on the back surface of the tape. Said polyimide foil 3 is absorbed by a vacuum chuck 6, and bonded to the desired position of the semiconductor chip 1.
JP11123880A 1980-08-13 1980-08-13 Semiconductor device Pending JPS5735356A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11123880A JPS5735356A (en) 1980-08-13 1980-08-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11123880A JPS5735356A (en) 1980-08-13 1980-08-13 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5735356A true JPS5735356A (en) 1982-02-25

Family

ID=14556068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11123880A Pending JPS5735356A (en) 1980-08-13 1980-08-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5735356A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643614A (en) * 1979-09-17 1981-04-22 Nippon Telegr & Teleph Corp <Ntt> Production of plug for optical fiber connector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643614A (en) * 1979-09-17 1981-04-22 Nippon Telegr & Teleph Corp <Ntt> Production of plug for optical fiber connector

Similar Documents

Publication Publication Date Title
JPS52124865A (en) Semiconductor device
IT8421373A0 (en) PROCEDURE FOR BONDING WOOD CHIPS AND SIMILAR USING LIQUID GLUE AND EQUIPMENT FOR CARRYING OUT THE PROCEDURE ITSELF.
MY100982A (en) Carrier film with conductive adhesive for dicing of semiconductor wafers
DK540489A (en) PACKAGING
JPS6438209A (en) Preparation of semiconductor device
JPS5735356A (en) Semiconductor device
JPS5363484A (en) Multilayer structure
JPS5577160A (en) Semiconductor device
JPS6451707A (en) Manufacture of surface acoustic wave chip device
JPS53101980A (en) Semiconductor device
JPS55115343A (en) Manufacture of semiconductor device
JPS5318960A (en) Bonding method
JPS5519817A (en) Integrated circuit lead protecting device
JPS53106570A (en) Production of semiconductor device
JPS5335380A (en) Production of semiconductor device using film carrier tape
JPS6482603A (en) Method of sticking cover to electronic component
EP0313127A3 (en) Adhesive tape cutting device for taping unit adhesive tape cutting device for taping unit
JPS5438765A (en) Semiconductor rectifying device
JPS5710993A (en) Semiconductor light emitting device
JPS6489356A (en) Hybrid integrated circuit
JPS54131871A (en) Packaging of ic case
JPS53117970A (en) Resin seal type semiconductor device
JPS5724309A (en) Adhesive tape or sheet for treatment
JPS5388076A (en) Multi-layer thermoplastic resin structure
JPS5529146A (en) Auto die bonder