JPS5730350A - Elat type semiconductor device - Google Patents

Elat type semiconductor device

Info

Publication number
JPS5730350A
JPS5730350A JP10451580A JP10451580A JPS5730350A JP S5730350 A JPS5730350 A JP S5730350A JP 10451580 A JP10451580 A JP 10451580A JP 10451580 A JP10451580 A JP 10451580A JP S5730350 A JPS5730350 A JP S5730350A
Authority
JP
Japan
Prior art keywords
positioning
semiconductor element
semiconductor device
container
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10451580A
Other languages
Japanese (ja)
Inventor
Yukiyasu Usunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10451580A priority Critical patent/JPS5730350A/en
Publication of JPS5730350A publication Critical patent/JPS5730350A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To obtain a flat type semiconductor device in which a semiconductor element and a radiator are accurately coaxially placed by soldering a positioning member to a sealed container itself. CONSTITUTION:A semiconductor device 1 is fusion-bonded to a heat compensator 2 made of W, Mo or the like with solder made of aluminum alloy to form a semiconductor element 3. A positioning member 14 for positioning the semiconductor element 3 is soldered to both the annular insulator 10 and the flange 11 of a container at the time of assembling the container. The axially centering accuracy of a radiator 4, flanges 15, 11, annular insulator 10 and positioning metal 14 can be improved at the time of assembling the container, thereby improving the positional accuracy of the semiconductor element 3 to be engaged with the positioning metallic member 14.
JP10451580A 1980-07-30 1980-07-30 Elat type semiconductor device Pending JPS5730350A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10451580A JPS5730350A (en) 1980-07-30 1980-07-30 Elat type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10451580A JPS5730350A (en) 1980-07-30 1980-07-30 Elat type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5730350A true JPS5730350A (en) 1982-02-18

Family

ID=14382622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10451580A Pending JPS5730350A (en) 1980-07-30 1980-07-30 Elat type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5730350A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1984000641A1 (en) * 1982-07-26 1984-02-16 Mitsubishi Electric Corp Thyristor and method of fabrication thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1984000641A1 (en) * 1982-07-26 1984-02-16 Mitsubishi Electric Corp Thyristor and method of fabrication thereof
US4677454A (en) * 1982-07-26 1987-06-30 Mitsubishi Denki Kabushiki Kaisha Thyristor with self-centering housing means

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