JPS5730067A - Microcomputer module - Google Patents

Microcomputer module

Info

Publication number
JPS5730067A
JPS5730067A JP10613080A JP10613080A JPS5730067A JP S5730067 A JPS5730067 A JP S5730067A JP 10613080 A JP10613080 A JP 10613080A JP 10613080 A JP10613080 A JP 10613080A JP S5730067 A JPS5730067 A JP S5730067A
Authority
JP
Japan
Prior art keywords
chip
pla
socket
fitted
microcomputer module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10613080A
Other languages
Japanese (ja)
Inventor
Kosuke Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP10613080A priority Critical patent/JPS5730067A/en
Publication of JPS5730067A publication Critical patent/JPS5730067A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Calculators And Similar Devices (AREA)

Abstract

PURPOSE:To make the size of a system small, by constituting the system in LSI package unit. CONSTITUTION:An IC socket 22 is provided on a common bus board 1, and to the said socket 22, a CPU chip 23, ROM chips 24, 25, RAM chip 26, and I/0 chip 27 are fitted. An input and output device 30 is fitted to a terminal Q of the I/0 chip 27 via a connector 28 and a cable 29. A crystal oscillator 31 is connected to the side surface of the CPU chip. The said chip is provided with a PLA (Programmable Logic Array) and chip selection is made with this PLA.
JP10613080A 1980-07-30 1980-07-30 Microcomputer module Pending JPS5730067A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10613080A JPS5730067A (en) 1980-07-30 1980-07-30 Microcomputer module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10613080A JPS5730067A (en) 1980-07-30 1980-07-30 Microcomputer module

Publications (1)

Publication Number Publication Date
JPS5730067A true JPS5730067A (en) 1982-02-18

Family

ID=14425817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10613080A Pending JPS5730067A (en) 1980-07-30 1980-07-30 Microcomputer module

Country Status (1)

Country Link
JP (1) JPS5730067A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6237785A (en) * 1985-08-12 1987-02-18 Nec Corp Optical mark reading device
CN1299888C (en) * 2003-07-31 2007-02-14 北京化工大学 Ultrahigh molecular weight polyethylene injection moulding method and mould thereof
CN1301843C (en) * 2003-08-01 2007-02-28 北京化工大学 Ultrahigh molecular weight polyethylene injection moulding machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5463633A (en) * 1977-10-03 1979-05-22 Nec Corp Semiconductor integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5463633A (en) * 1977-10-03 1979-05-22 Nec Corp Semiconductor integrated circuit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6237785A (en) * 1985-08-12 1987-02-18 Nec Corp Optical mark reading device
JPH0476157B2 (en) * 1985-08-12 1992-12-02 Nippon Electric Co
CN1299888C (en) * 2003-07-31 2007-02-14 北京化工大学 Ultrahigh molecular weight polyethylene injection moulding method and mould thereof
CN1301843C (en) * 2003-08-01 2007-02-28 北京化工大学 Ultrahigh molecular weight polyethylene injection moulding machine

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