JPS5728350A - Manufacture of hybrid integrated circuit - Google Patents

Manufacture of hybrid integrated circuit

Info

Publication number
JPS5728350A
JPS5728350A JP10344280A JP10344280A JPS5728350A JP S5728350 A JPS5728350 A JP S5728350A JP 10344280 A JP10344280 A JP 10344280A JP 10344280 A JP10344280 A JP 10344280A JP S5728350 A JPS5728350 A JP S5728350A
Authority
JP
Japan
Prior art keywords
resistor
resistors
trimming
pattern
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10344280A
Other languages
Japanese (ja)
Inventor
Yasumasa Fukushima
Ritsu Tawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10344280A priority Critical patent/JPS5728350A/en
Publication of JPS5728350A publication Critical patent/JPS5728350A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE:To simplify the mask pattern and to make resistors suitable for a resistor array and the like, by a method wherein a plurality of resistors to be provided on a substrate are connected in parallel to obtain standardized pattern resistors, and the pattern is trimmed to obtain a predetermined resistance value. CONSTITUTION:For example, as a standard pattern, a construction in which three resistor films 7-9 are connected in parallel between electrodes 2, 2 is formed. In order to make the character of the resistor films 7-9 the same, the resistance values of the resistor films 7-9 are determined so as to have relationship of R1< R2<R3, to obtain a wide range of resistance values. For example, when the rated value R0 of the resistor to be required is shown by R2<R0<R2MAX (wherein R2 MAX is the maximum resistance obtained by trimming R2), the resistor films 7, 9 are cut and the trimming 4 of, for example, L shape is applied to the resistor film 8. For the trimming and the cutting, for example, laser is used. Thus a plurality of resistors having various rated values respectively are manufacured easily without using a number of masks.
JP10344280A 1980-07-28 1980-07-28 Manufacture of hybrid integrated circuit Pending JPS5728350A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10344280A JPS5728350A (en) 1980-07-28 1980-07-28 Manufacture of hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10344280A JPS5728350A (en) 1980-07-28 1980-07-28 Manufacture of hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS5728350A true JPS5728350A (en) 1982-02-16

Family

ID=14354142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10344280A Pending JPS5728350A (en) 1980-07-28 1980-07-28 Manufacture of hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5728350A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58208633A (en) * 1982-05-31 1983-12-05 Tokyo Electric Co Ltd Strain sensor
JPS6139505A (en) * 1984-07-31 1986-02-25 沖電気工業株式会社 Method of trimming thick film resistor
WO2001059793A1 (en) * 2000-02-09 2001-08-16 Robert Bosch Gmbh Adjustable resistor arrangement, method for the production thereof and associated adjustment method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58208633A (en) * 1982-05-31 1983-12-05 Tokyo Electric Co Ltd Strain sensor
JPS6139505A (en) * 1984-07-31 1986-02-25 沖電気工業株式会社 Method of trimming thick film resistor
WO2001059793A1 (en) * 2000-02-09 2001-08-16 Robert Bosch Gmbh Adjustable resistor arrangement, method for the production thereof and associated adjustment method

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