JPS5618453A - Functional trimming of hybrid integrated circuit device - Google Patents

Functional trimming of hybrid integrated circuit device

Info

Publication number
JPS5618453A
JPS5618453A JP9336679A JP9336679A JPS5618453A JP S5618453 A JPS5618453 A JP S5618453A JP 9336679 A JP9336679 A JP 9336679A JP 9336679 A JP9336679 A JP 9336679A JP S5618453 A JPS5618453 A JP S5618453A
Authority
JP
Japan
Prior art keywords
circuit device
resistor
integrated circuit
hybrid integrated
trimming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9336679A
Other languages
Japanese (ja)
Inventor
Izumi Toriyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9336679A priority Critical patent/JPS5618453A/en
Publication of JPS5618453A publication Critical patent/JPS5618453A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE:To accurately trim a hybrid integrated circuit device without increasing a resistance area by forming it of special resistors having large and small resistance values and trimming it thereby. CONSTITUTION:A functional trimming resistor R consists of a resistor 21 having large resistance value between conductive passages 1a and 1b and a resistor 22 having small resistance value between conductor passages 1b and 1c connected in series with each other. The resistor 21 is so trimmed that the composite resistance of both the resistors 21 and 22 may become predetermined value before forming the construction of the a circuit device, and the resistor 22 is so trimmed that the characteristics of the circuit device may become a predetermined value after forming the circuit device.
JP9336679A 1979-07-23 1979-07-23 Functional trimming of hybrid integrated circuit device Pending JPS5618453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9336679A JPS5618453A (en) 1979-07-23 1979-07-23 Functional trimming of hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9336679A JPS5618453A (en) 1979-07-23 1979-07-23 Functional trimming of hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5618453A true JPS5618453A (en) 1981-02-21

Family

ID=14080284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9336679A Pending JPS5618453A (en) 1979-07-23 1979-07-23 Functional trimming of hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5618453A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054466A (en) * 1983-09-05 1985-03-28 Soshin Denki Kk Accurate resistor of thick film integrated circuit and manufacture thereof
FR2607627A1 (en) * 1986-12-02 1988-06-03 Toshiba Kk DEVICE WITH AN INTEGRATED CIRCUIT IN THICK FILM, CAPABLE OF BEING MANUFACTURED BY MEANS OF AN OPERATION, EASY TO IMPLEMENT, ADJUSTING BY REMOVING MATERIAL

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054466A (en) * 1983-09-05 1985-03-28 Soshin Denki Kk Accurate resistor of thick film integrated circuit and manufacture thereof
FR2607627A1 (en) * 1986-12-02 1988-06-03 Toshiba Kk DEVICE WITH AN INTEGRATED CIRCUIT IN THICK FILM, CAPABLE OF BEING MANUFACTURED BY MEANS OF AN OPERATION, EASY TO IMPLEMENT, ADJUSTING BY REMOVING MATERIAL

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