JPS5723283A - Manufacture of semiconductor light emitting device - Google Patents

Manufacture of semiconductor light emitting device

Info

Publication number
JPS5723283A
JPS5723283A JP9722180A JP9722180A JPS5723283A JP S5723283 A JPS5723283 A JP S5723283A JP 9722180 A JP9722180 A JP 9722180A JP 9722180 A JP9722180 A JP 9722180A JP S5723283 A JPS5723283 A JP S5723283A
Authority
JP
Japan
Prior art keywords
lens
bonding agent
diode
semiconductor light
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9722180A
Other languages
Japanese (ja)
Inventor
Hideto Furuyama
Yutaka Uematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9722180A priority Critical patent/JPS5723283A/en
Publication of JPS5723283A publication Critical patent/JPS5723283A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To obtain an accurate alignment between an element and a lens, by a method wherein a thermosetting bonding agent is applied on the lower surface of the spherical lens while it is being held by a vacuum tweezer, the lens is contacted with the upper face of the semiconductor light-emitting element placed on a stem heated at a suitable temperature, and it is bonded while a microscope is being used to observe them. CONSTITUTION:A surface illuminating type light-emitting diode 1 is mounted on a mounting stem 3, the diode 1 is heated by a heater 4 to the temperature cooresponding to the bonding agent used. A spherical lens 2 is sucked and held by a vacuum tweezer 10 and moved to a container of the bonding agent to apply a transparent thermosetting bonding agent 15 of a silicon resin on the lower surface of the lens 2. Then, the position of the lens 2 is adjusted by using of a microscope 14 so that the lens 2 contacts with the diode 1. After the bonding agent 15 is hardened, the lens 2 and the diode 1 are fixed. Then, said light-emitting element is removed as a unit from the stem 3 and transferred to the subsequent process to complet a semiconductor light-emitting element.
JP9722180A 1980-07-16 1980-07-16 Manufacture of semiconductor light emitting device Pending JPS5723283A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9722180A JPS5723283A (en) 1980-07-16 1980-07-16 Manufacture of semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9722180A JPS5723283A (en) 1980-07-16 1980-07-16 Manufacture of semiconductor light emitting device

Publications (1)

Publication Number Publication Date
JPS5723283A true JPS5723283A (en) 1982-02-06

Family

ID=14186571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9722180A Pending JPS5723283A (en) 1980-07-16 1980-07-16 Manufacture of semiconductor light emitting device

Country Status (1)

Country Link
JP (1) JPS5723283A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04230050A (en) * 1990-06-22 1992-08-19 Internatl Business Mach Corp <Ibm> Apparatus and method for passive alignment, fixing method of object, method and apparatus for alignment of object, and batch manufacturing method
JP2011119699A (en) * 2009-11-05 2011-06-16 Nichia Corp Semiconductor laser device and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04230050A (en) * 1990-06-22 1992-08-19 Internatl Business Mach Corp <Ibm> Apparatus and method for passive alignment, fixing method of object, method and apparatus for alignment of object, and batch manufacturing method
JP2011119699A (en) * 2009-11-05 2011-06-16 Nichia Corp Semiconductor laser device and method of manufacturing the same

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