JPS5721833A - Transporting method for semiconductor substrate - Google Patents

Transporting method for semiconductor substrate

Info

Publication number
JPS5721833A
JPS5721833A JP9709380A JP9709380A JPS5721833A JP S5721833 A JPS5721833 A JP S5721833A JP 9709380 A JP9709380 A JP 9709380A JP 9709380 A JP9709380 A JP 9709380A JP S5721833 A JPS5721833 A JP S5721833A
Authority
JP
Japan
Prior art keywords
magnetic field
substrate
semiconductor substrate
generator
transporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9709380A
Other languages
Japanese (ja)
Inventor
Kazutoshi Nagano
Hiroshi Kadota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9709380A priority Critical patent/JPS5721833A/en
Publication of JPS5721833A publication Critical patent/JPS5721833A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To enable the automatic production line in combination with a semiconductor manufacturing apparatus by transporting a semiconductor substrate by floating the substrate from a transporting cylinder by the repelling action of the magnetic force and positioning it at the prescribed position. CONSTITUTION:A transporting cylinder 11 isolates a semiconductor substrate 13 from external atmosphere, a magnetic field generator 12 is provided in the vicinity of the exterior, the magnetic field distribution of the generator 12 is as shown by broken line 19, and the valley 20 of the magnetic field distribution is moved in a direction of an arrow 14 in parallel with the cylinder 11. On the other hand, photoresist mixed with magnetic powder is coated on the back surface in the magnetic field, a semiconductor substrate 13 enabling the magnetic field distribution 18 even if the magnetic field is removed, is inserted, and when the magnetic field of the generator 12 is moved, the valley 20 of the magnetic field floats the substrate 13 and starts moving. Thus, when the substrate reaches desired position, the magnetic field is stopped, and the substrate can be accurately positioned.
JP9709380A 1980-07-15 1980-07-15 Transporting method for semiconductor substrate Pending JPS5721833A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9709380A JPS5721833A (en) 1980-07-15 1980-07-15 Transporting method for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9709380A JPS5721833A (en) 1980-07-15 1980-07-15 Transporting method for semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5721833A true JPS5721833A (en) 1982-02-04

Family

ID=14183015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9709380A Pending JPS5721833A (en) 1980-07-15 1980-07-15 Transporting method for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5721833A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50124381A (en) * 1974-03-16 1975-09-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50124381A (en) * 1974-03-16 1975-09-30

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