JPS5720440A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5720440A
JPS5720440A JP8004080A JP8004080A JPS5720440A JP S5720440 A JPS5720440 A JP S5720440A JP 8004080 A JP8004080 A JP 8004080A JP 8004080 A JP8004080 A JP 8004080A JP S5720440 A JPS5720440 A JP S5720440A
Authority
JP
Japan
Prior art keywords
leads
thermal resistance
film
chip
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8004080A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0113219B2 (enrdf_load_stackoverflow
Inventor
Hiromichi Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8004080A priority Critical patent/JPS5720440A/ja
Publication of JPS5720440A publication Critical patent/JPS5720440A/ja
Publication of JPH0113219B2 publication Critical patent/JPH0113219B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP8004080A 1980-06-13 1980-06-13 Semiconductor device Granted JPS5720440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8004080A JPS5720440A (en) 1980-06-13 1980-06-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8004080A JPS5720440A (en) 1980-06-13 1980-06-13 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5720440A true JPS5720440A (en) 1982-02-02
JPH0113219B2 JPH0113219B2 (enrdf_load_stackoverflow) 1989-03-03

Family

ID=13707126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8004080A Granted JPS5720440A (en) 1980-06-13 1980-06-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5720440A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4860087A (en) * 1986-03-26 1989-08-22 Hitachi, Ltd. Semiconductor device and process for producing the same
US4999700A (en) * 1989-04-20 1991-03-12 Honeywell Inc. Package to board variable pitch tab

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4860087A (en) * 1986-03-26 1989-08-22 Hitachi, Ltd. Semiconductor device and process for producing the same
US4999700A (en) * 1989-04-20 1991-03-12 Honeywell Inc. Package to board variable pitch tab

Also Published As

Publication number Publication date
JPH0113219B2 (enrdf_load_stackoverflow) 1989-03-03

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