JPS57203792A - Production of metal plated cu, cu alloy plate and rod material - Google Patents

Production of metal plated cu, cu alloy plate and rod material

Info

Publication number
JPS57203792A
JPS57203792A JP8548382A JP8548382A JPS57203792A JP S57203792 A JPS57203792 A JP S57203792A JP 8548382 A JP8548382 A JP 8548382A JP 8548382 A JP8548382 A JP 8548382A JP S57203792 A JPS57203792 A JP S57203792A
Authority
JP
Japan
Prior art keywords
plate
subjected
annealing
rolling
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8548382A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6114234B2 (enrdf_load_stackoverflow
Inventor
Akito Okamura
Mitsuzo Motoki
Rensei Futatsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP8548382A priority Critical patent/JPS57203792A/ja
Publication of JPS57203792A publication Critical patent/JPS57203792A/ja
Publication of JPS6114234B2 publication Critical patent/JPS6114234B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
JP8548382A 1982-05-20 1982-05-20 Production of metal plated cu, cu alloy plate and rod material Granted JPS57203792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8548382A JPS57203792A (en) 1982-05-20 1982-05-20 Production of metal plated cu, cu alloy plate and rod material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8548382A JPS57203792A (en) 1982-05-20 1982-05-20 Production of metal plated cu, cu alloy plate and rod material

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP4843479A Division JPS55141591A (en) 1979-04-19 1979-04-19 Manufacture of metal plating cu and cu alloy plate and filament material

Publications (2)

Publication Number Publication Date
JPS57203792A true JPS57203792A (en) 1982-12-14
JPS6114234B2 JPS6114234B2 (enrdf_load_stackoverflow) 1986-04-17

Family

ID=13860155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8548382A Granted JPS57203792A (en) 1982-05-20 1982-05-20 Production of metal plated cu, cu alloy plate and rod material

Country Status (1)

Country Link
JP (1) JPS57203792A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61201762A (ja) * 1985-03-05 1986-09-06 Furukawa Electric Co Ltd:The リードフレーム用Ｃｕ系条材の製造方法
DE3828700A1 (de) * 1987-09-16 1989-04-06 Nat Semiconductor Corp Kupferplattierter bleirahmen fuer halbleiter-kunststoff-gehaeuse

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61201762A (ja) * 1985-03-05 1986-09-06 Furukawa Electric Co Ltd:The リードフレーム用Ｃｕ系条材の製造方法
DE3828700A1 (de) * 1987-09-16 1989-04-06 Nat Semiconductor Corp Kupferplattierter bleirahmen fuer halbleiter-kunststoff-gehaeuse
DE3828700C2 (de) * 1987-09-16 2002-04-18 Nat Semiconductor Corp Kupferplattierter Leiterrahmen für Halbleiter-Kunststoff-Gehäuse

Also Published As

Publication number Publication date
JPS6114234B2 (enrdf_load_stackoverflow) 1986-04-17

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