JPS57200564A - Manufacture of enameled substrate - Google Patents
Manufacture of enameled substrateInfo
- Publication number
- JPS57200564A JPS57200564A JP8529681A JP8529681A JPS57200564A JP S57200564 A JPS57200564 A JP S57200564A JP 8529681 A JP8529681 A JP 8529681A JP 8529681 A JP8529681 A JP 8529681A JP S57200564 A JPS57200564 A JP S57200564A
- Authority
- JP
- Japan
- Prior art keywords
- frit
- substrate sections
- support frame
- masking material
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
PURPOSE: To produce efficiently enameled substrates for printed circuits, by applying a frit on substrate sections supported by a support frame with part other than the substrate sections masked with a masking material, and calcining the frit after removing the masking material.
CONSTITUTION: A metal sheet is blanked into a blanked sheet 4 having the plurality of the substrate sections 2 supported by the support frame 1 via connections 3. After pretreatments such as degreasing and derusting has been carried out on the blank sheet 4, the connections 3 and the support frame 1 are coated with a masking material, so that only the substrate sections 2 are exposed. Then, when the blank sheet 4 is coated with an enamel frit, only the substrate sections 2 are coated with the frit. Thereafter, the masking material is removed, the frit is calcined to form an enamel layer on the substrate sections 2, and the connections 3 are cut off to remove each substrate section 2 from the support frame 1.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8529681A JPS57200564A (en) | 1981-06-03 | 1981-06-03 | Manufacture of enameled substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8529681A JPS57200564A (en) | 1981-06-03 | 1981-06-03 | Manufacture of enameled substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57200564A true JPS57200564A (en) | 1982-12-08 |
Family
ID=13854616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8529681A Pending JPS57200564A (en) | 1981-06-03 | 1981-06-03 | Manufacture of enameled substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57200564A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59173271A (en) * | 1983-03-23 | 1984-10-01 | Fujikura Ltd | Manufacture of enameled product |
JPS6011494U (en) * | 1983-07-04 | 1985-01-25 | 株式会社フジクラ | Mounting structure of metal core printed circuit board |
JPS63188973U (en) * | 1987-05-28 | 1988-12-05 | ||
JPH02126696A (en) * | 1988-11-07 | 1990-05-15 | Fujikura Ltd | Enameled wiring board and manufacture thereof |
JPH0379776A (en) * | 1989-08-23 | 1991-04-04 | Nippon Furitsuto Kk | Method for firing enameled plate |
-
1981
- 1981-06-03 JP JP8529681A patent/JPS57200564A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59173271A (en) * | 1983-03-23 | 1984-10-01 | Fujikura Ltd | Manufacture of enameled product |
JPS6011494U (en) * | 1983-07-04 | 1985-01-25 | 株式会社フジクラ | Mounting structure of metal core printed circuit board |
JPS63188973U (en) * | 1987-05-28 | 1988-12-05 | ||
JPH02126696A (en) * | 1988-11-07 | 1990-05-15 | Fujikura Ltd | Enameled wiring board and manufacture thereof |
JPH0379776A (en) * | 1989-08-23 | 1991-04-04 | Nippon Furitsuto Kk | Method for firing enameled plate |
JP2519324B2 (en) * | 1989-08-23 | 1996-07-31 | 日本フリット株式会社 | Enamel board firing method |
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