JPS57184224A - Microwave plasma treating method and its device - Google Patents
Microwave plasma treating method and its deviceInfo
- Publication number
- JPS57184224A JPS57184224A JP6986881A JP6986881A JPS57184224A JP S57184224 A JPS57184224 A JP S57184224A JP 6986881 A JP6986881 A JP 6986881A JP 6986881 A JP6986881 A JP 6986881A JP S57184224 A JPS57184224 A JP S57184224A
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- treating
- shielding plate
- openings
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE:To improve the characteristics of etching by dividing a plasma treating device into two of a plasma generating region and a treating region, shielding the two regions by a metallic shielding plate, introducing only active plasma into the treating region and integrally forming the device by a metallic material. CONSTITUTION:A microwave treating chamber is formed by the plasma generating section 12 and the treating section 13, and the metallic shielding plate 14, to an intermediate section thereof openings are formed, is mounted. Plasma particles having high energy are limited to the plasma generating section 12 by the shielding plate 14, and only active plasma particles react with a sample 17 arranged onto a smaple base 20 through the openings of the shielding plate 14. The shielding plate 14 is formed by a 5mm. thick aluminum plate with a diameter such as an approximately 2mm. diameter, which has a large number of the openings. The whole treating chamber is shaped integrally by 10mm. thick aluminum, which is easy to be worked and resists pressure. Accordingly, the plasma particles having high energy do not damage the sample 17, and etching can be conducted under an excellent condition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6986881A JPS57184224A (en) | 1981-05-08 | 1981-05-08 | Microwave plasma treating method and its device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6986881A JPS57184224A (en) | 1981-05-08 | 1981-05-08 | Microwave plasma treating method and its device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57184224A true JPS57184224A (en) | 1982-11-12 |
JPH0415613B2 JPH0415613B2 (en) | 1992-03-18 |
Family
ID=13415196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6986881A Granted JPS57184224A (en) | 1981-05-08 | 1981-05-08 | Microwave plasma treating method and its device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57184224A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59169135A (en) * | 1983-03-16 | 1984-09-25 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS612320A (en) * | 1984-06-15 | 1986-01-08 | Toshiba Corp | Sample processing device |
JPH05129235A (en) * | 1991-10-31 | 1993-05-25 | Yuichi Sakamoto | Ecr-type plasma processing apparatus |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52126177A (en) * | 1976-04-15 | 1977-10-22 | Hitachi Ltd | Etching device |
JPS536239A (en) * | 1976-07-08 | 1978-01-20 | Nippon Electric Co | Plasma etching method |
JPS5341076A (en) * | 1976-09-27 | 1978-04-14 | Toshiba Corp | Process for treating bulb wastes containing mercury |
JPS5424580A (en) * | 1977-07-27 | 1979-02-23 | Toshiba Corp | Etching method |
JPS5449073A (en) * | 1977-09-26 | 1979-04-18 | Mitsubishi Electric Corp | Plasma processing unit |
JPS5532423A (en) * | 1978-08-25 | 1980-03-07 | Rhythm Watch Co Ltd | Winding method and construction of motor coil |
-
1981
- 1981-05-08 JP JP6986881A patent/JPS57184224A/en active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52126177A (en) * | 1976-04-15 | 1977-10-22 | Hitachi Ltd | Etching device |
JPS536239A (en) * | 1976-07-08 | 1978-01-20 | Nippon Electric Co | Plasma etching method |
JPS5341076A (en) * | 1976-09-27 | 1978-04-14 | Toshiba Corp | Process for treating bulb wastes containing mercury |
JPS5424580A (en) * | 1977-07-27 | 1979-02-23 | Toshiba Corp | Etching method |
JPS5449073A (en) * | 1977-09-26 | 1979-04-18 | Mitsubishi Electric Corp | Plasma processing unit |
JPS5532423A (en) * | 1978-08-25 | 1980-03-07 | Rhythm Watch Co Ltd | Winding method and construction of motor coil |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59169135A (en) * | 1983-03-16 | 1984-09-25 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS612320A (en) * | 1984-06-15 | 1986-01-08 | Toshiba Corp | Sample processing device |
JPH05129235A (en) * | 1991-10-31 | 1993-05-25 | Yuichi Sakamoto | Ecr-type plasma processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH0415613B2 (en) | 1992-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0380119A3 (en) | Microwave plasma processing apparatus | |
JPS57131374A (en) | Plasma etching device | |
JPS5531154A (en) | Plasma etching apparatus | |
JPS5687670A (en) | Dry etching apparatus | |
JPS57184224A (en) | Microwave plasma treating method and its device | |
JPS5343594A (en) | Ion source for chemical ionization | |
JPS53136374A (en) | Low pressure vapor discharge lamp | |
JPS5617902A (en) | Water dissociating method utilizing microwave plasma phenomenon | |
JPS5539690A (en) | Plasma etching device | |
JPS5638819A (en) | Dry etching device | |
JPS57117240A (en) | High-frequency sputtering etching device | |
JPS526076A (en) | Manufacturing process of cathode ray tube | |
JPS57182326A (en) | Treatment for imparting hydrophilicity to surface of hydrophobic resin molding | |
JPS5732637A (en) | Dry etching apparatus | |
JPS56135934A (en) | Dry etching device | |
JPS5533090A (en) | Etching method | |
JPS5530827A (en) | Plasmaetching device | |
JPS52142971A (en) | Plasma treating device | |
JPS53126859A (en) | Field radiation type electronic gun | |
JPS5687671A (en) | Dry etching apparatus | |
JPS57121234A (en) | Plasma processing and device thereof | |
JPS5427349A (en) | Electron tube | |
JPS57154833A (en) | Etching method by reactive ion | |
JPS5735681A (en) | Vacuum device | |
JPS5669374A (en) | Dry etching method |