JPS5718345A - Triode semiconductor element - Google Patents

Triode semiconductor element

Info

Publication number
JPS5718345A
JPS5718345A JP9373680A JP9373680A JPS5718345A JP S5718345 A JPS5718345 A JP S5718345A JP 9373680 A JP9373680 A JP 9373680A JP 9373680 A JP9373680 A JP 9373680A JP S5718345 A JPS5718345 A JP S5718345A
Authority
JP
Japan
Prior art keywords
electrode
semiconductor element
electrode body
leadless
glass tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9373680A
Other languages
Japanese (ja)
Other versions
JPS6050351B2 (en
Inventor
Akira Momose
Kazuo Nakada
Mitsumasa Iwahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP55093736A priority Critical patent/JPS6050351B2/en
Publication of JPS5718345A publication Critical patent/JPS5718345A/en
Publication of JPS6050351B2 publication Critical patent/JPS6050351B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To form a leadless triode semiconductor element by a method wherein the leadless triode semiconductor element is consisted of a pair of cylindrical main electrode bodies connected to both end parts of a semiconductor element, a cylindrical middle electrode body connected to the third electrode existing on the side of the element and glass tubes extending over both sides. CONSTITUTION:The glass tube body 2 is inserted on the small diametral end part 11 of the first main electrode body 1, and an electrode on the lower face of the semiconductor element body 3 is put on the upper face of the end part 11. The circular middle electrode body 4 is put on the end face of the glass tube body 2 being made to come in contact with an electrode 31 positioning at the circumference of the upper face of the electrode body 3, and a connecting electrode body 5 is connected to an electrode at the center of the upper face of the element body 3. The second glass tube 6 is put on the middle electrode body 4, and the small diametral end part 71 of the second main electrode body 7 in put on the connecting electrode body 5 inserting into the opening part. They are arranged in an assembling jig 8, and the respective parts are fusion welded to be connected. Accordingly the leadless semiconductor element solderable directly to the substrate printed with wiring can be obtained without using lead wire.
JP55093736A 1980-07-09 1980-07-09 3-pole semiconductor device Expired JPS6050351B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55093736A JPS6050351B2 (en) 1980-07-09 1980-07-09 3-pole semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55093736A JPS6050351B2 (en) 1980-07-09 1980-07-09 3-pole semiconductor device

Publications (2)

Publication Number Publication Date
JPS5718345A true JPS5718345A (en) 1982-01-30
JPS6050351B2 JPS6050351B2 (en) 1985-11-08

Family

ID=14090688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55093736A Expired JPS6050351B2 (en) 1980-07-09 1980-07-09 3-pole semiconductor device

Country Status (1)

Country Link
JP (1) JPS6050351B2 (en)

Also Published As

Publication number Publication date
JPS6050351B2 (en) 1985-11-08

Similar Documents

Publication Publication Date Title
DE68922198D1 (en) Sealed lead acid battery with tubular electrode.
JPS5718345A (en) Triode semiconductor element
DE3362907D1 (en) Method of securing two parts to each other
JPS56108282A (en) Solar cell module
UA5691A1 (en) Method and device of resistance welding of plastic body inside tubular metal rod
JPS56160639A (en) Testing method for solderability
JPS56120149A (en) Semiconductor element
JPS579028A (en) Electron tube cathode structure and preparation
JPS5774949A (en) Cathode ray tube
JPS5643812A (en) Piezoelectric holder
JPS5933176Y2 (en) airtight terminal
JPS57122558A (en) Manufacture of lead for electrode
JPS57131066A (en) Solid electrochemical element
JPS5650601A (en) Uhf antenna device
JPS57211760A (en) Electronic parts
JPS6228453U (en)
JPS55166845A (en) Manufacturing method of cathode structure for magnetron
JPS56129414A (en) Soldering method of reed wire to piezoelectric oscillator
JPS5782950A (en) Direct heated color braun tube
JPS5665438A (en) Supporting structure for shadow mask
JPS55102147A (en) Bulb
JPS56100455A (en) Manufacture of semiconductor device
JPS56148050A (en) Oxygen sensor
JPS56142451A (en) Manufacturing of oxygen sensor
JPH0220250U (en)