JPS57183042A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57183042A
JPS57183042A JP56068138A JP6813881A JPS57183042A JP S57183042 A JPS57183042 A JP S57183042A JP 56068138 A JP56068138 A JP 56068138A JP 6813881 A JP6813881 A JP 6813881A JP S57183042 A JPS57183042 A JP S57183042A
Authority
JP
Japan
Prior art keywords
layer
heat treatment
voltage drop
composition ratio
forward voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56068138A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6122459B2 (https=
Inventor
Noboru Baba
Hiroshi Soeno
Hitoshi Onuki
Masateru Suwa
Kenichi Kizawa
Keiichi Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56068138A priority Critical patent/JPS57183042A/ja
Publication of JPS57183042A publication Critical patent/JPS57183042A/ja
Publication of JPS6122459B2 publication Critical patent/JPS6122459B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders

Landscapes

  • Die Bonding (AREA)
JP56068138A 1981-05-08 1981-05-08 Semiconductor device Granted JPS57183042A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56068138A JPS57183042A (en) 1981-05-08 1981-05-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56068138A JPS57183042A (en) 1981-05-08 1981-05-08 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57183042A true JPS57183042A (en) 1982-11-11
JPS6122459B2 JPS6122459B2 (https=) 1986-05-31

Family

ID=13365079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56068138A Granted JPS57183042A (en) 1981-05-08 1981-05-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57183042A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008041707A (ja) * 2006-08-01 2008-02-21 Nissan Motor Co Ltd 半導体装置及びその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187051U (https=) * 1984-11-15 1986-06-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008041707A (ja) * 2006-08-01 2008-02-21 Nissan Motor Co Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPS6122459B2 (https=) 1986-05-31

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