JPS57178327A - Washer - Google Patents

Washer

Info

Publication number
JPS57178327A
JPS57178327A JP6249081A JP6249081A JPS57178327A JP S57178327 A JPS57178327 A JP S57178327A JP 6249081 A JP6249081 A JP 6249081A JP 6249081 A JP6249081 A JP 6249081A JP S57178327 A JPS57178327 A JP S57178327A
Authority
JP
Japan
Prior art keywords
wafer
oscillator
pure water
rotated
supplied
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6249081A
Other languages
English (en)
Inventor
Masao Tsugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6249081A priority Critical patent/JPS57178327A/ja
Publication of JPS57178327A publication Critical patent/JPS57178327A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP6249081A 1981-04-27 1981-04-27 Washer Pending JPS57178327A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6249081A JPS57178327A (en) 1981-04-27 1981-04-27 Washer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6249081A JPS57178327A (en) 1981-04-27 1981-04-27 Washer

Publications (1)

Publication Number Publication Date
JPS57178327A true JPS57178327A (en) 1982-11-02

Family

ID=13201659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6249081A Pending JPS57178327A (en) 1981-04-27 1981-04-27 Washer

Country Status (1)

Country Link
JP (1) JPS57178327A (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0157675A2 (en) * 1984-03-06 1985-10-09 Fujitsu Limited Spinning device for processing a substrate, in particular a semiconductor wafer
JPS61174159U (ja) * 1985-04-18 1986-10-29
EP0390134A2 (en) * 1989-03-30 1990-10-03 Kabushiki Kaisha Toshiba Method and apparatus for cleaning semiconductor devices
JPH02252238A (ja) * 1989-03-25 1990-10-11 Tokyo Electron Ltd 基板の洗浄装置
JPH04161290A (ja) * 1990-10-26 1992-06-04 Fujitsu Ltd 純水製造装置および半導体基板の純水処理方法
KR101399836B1 (ko) * 2012-12-24 2014-06-27 주식회사 케이씨텍 화학 기계적 연마 공정이 행해진 웨이퍼의 웨팅 장치 및 방법
CN105880243A (zh) * 2016-05-31 2016-08-24 广东金鼎光学技术股份有限公司 用于光学玻璃镜片的超声波超纯水清洗工艺

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0157675A2 (en) * 1984-03-06 1985-10-09 Fujitsu Limited Spinning device for processing a substrate, in particular a semiconductor wafer
JPS61174159U (ja) * 1985-04-18 1986-10-29
JPH02252238A (ja) * 1989-03-25 1990-10-11 Tokyo Electron Ltd 基板の洗浄装置
EP0390134A2 (en) * 1989-03-30 1990-10-03 Kabushiki Kaisha Toshiba Method and apparatus for cleaning semiconductor devices
JPH04161290A (ja) * 1990-10-26 1992-06-04 Fujitsu Ltd 純水製造装置および半導体基板の純水処理方法
KR101399836B1 (ko) * 2012-12-24 2014-06-27 주식회사 케이씨텍 화학 기계적 연마 공정이 행해진 웨이퍼의 웨팅 장치 및 방법
CN105880243A (zh) * 2016-05-31 2016-08-24 广东金鼎光学技术股份有限公司 用于光学玻璃镜片的超声波超纯水清洗工艺

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