JPS57173954A - Ultrasonic wave wire bonding device - Google Patents

Ultrasonic wave wire bonding device

Info

Publication number
JPS57173954A
JPS57173954A JP56057854A JP5785481A JPS57173954A JP S57173954 A JPS57173954 A JP S57173954A JP 56057854 A JP56057854 A JP 56057854A JP 5785481 A JP5785481 A JP 5785481A JP S57173954 A JPS57173954 A JP S57173954A
Authority
JP
Japan
Prior art keywords
horn
held
wire
capillary
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56057854A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6227741B2 (enExample
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP56057854A priority Critical patent/JPS57173954A/ja
Publication of JPS57173954A publication Critical patent/JPS57173954A/ja
Publication of JPS6227741B2 publication Critical patent/JPS6227741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56057854A 1981-04-18 1981-04-18 Ultrasonic wave wire bonding device Granted JPS57173954A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56057854A JPS57173954A (en) 1981-04-18 1981-04-18 Ultrasonic wave wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56057854A JPS57173954A (en) 1981-04-18 1981-04-18 Ultrasonic wave wire bonding device

Publications (2)

Publication Number Publication Date
JPS57173954A true JPS57173954A (en) 1982-10-26
JPS6227741B2 JPS6227741B2 (enExample) 1987-06-16

Family

ID=13067567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56057854A Granted JPS57173954A (en) 1981-04-18 1981-04-18 Ultrasonic wave wire bonding device

Country Status (1)

Country Link
JP (1) JPS57173954A (enExample)

Also Published As

Publication number Publication date
JPS6227741B2 (enExample) 1987-06-16

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