JPS55125925A - Stripping method of wire and apparatus therefor - Google Patents

Stripping method of wire and apparatus therefor

Info

Publication number
JPS55125925A
JPS55125925A JP3320479A JP3320479A JPS55125925A JP S55125925 A JPS55125925 A JP S55125925A JP 3320479 A JP3320479 A JP 3320479A JP 3320479 A JP3320479 A JP 3320479A JP S55125925 A JPS55125925 A JP S55125925A
Authority
JP
Japan
Prior art keywords
die
wire materials
wire
stripping
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3320479A
Other languages
Japanese (ja)
Inventor
Masao Inoue
Toshio Hijikata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP3320479A priority Critical patent/JPS55125925A/en
Publication of JPS55125925A publication Critical patent/JPS55125925A/en
Pending legal-status Critical Current

Links

Landscapes

  • Milling, Broaching, Filing, Reaming, And Others (AREA)
  • Turning (AREA)

Abstract

PURPOSE: To reduce stripping resistance and prolong the life span of a die by stripping wires, applying high frequency oscillation in an ultrasonic wave area to the die.
CONSTITUTION: When the wire materials 1 are sent to the direction of arrow (a) through the circular cutter 4 of the die 3, it is stripped by the circular cutter 4. The drive oscillator 5 with the wire materials path 2 is mounted on the die 3 and the high frequency oscillation in an ultrasonic wave area which is in parallel with the die feeding direction is applied to the die. Since the die and the wire materials repeatedly collapse, contact, and are separated in a short period of time, stripping resistance is reduced and the life span of the die can thus be prolonged.
COPYRIGHT: (C)1980,JPO&Japio
JP3320479A 1979-03-23 1979-03-23 Stripping method of wire and apparatus therefor Pending JPS55125925A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3320479A JPS55125925A (en) 1979-03-23 1979-03-23 Stripping method of wire and apparatus therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3320479A JPS55125925A (en) 1979-03-23 1979-03-23 Stripping method of wire and apparatus therefor

Publications (1)

Publication Number Publication Date
JPS55125925A true JPS55125925A (en) 1980-09-29

Family

ID=12379927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3320479A Pending JPS55125925A (en) 1979-03-23 1979-03-23 Stripping method of wire and apparatus therefor

Country Status (1)

Country Link
JP (1) JPS55125925A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165901A (en) * 1982-03-25 1983-10-01 Shimada Phys & Chem Ind Co Ltd Ultrasonic vibration cutting device
JPS58191901U (en) * 1982-06-16 1983-12-20 島田理化工業株式会社 Ultrasonic vibration cutting equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165901A (en) * 1982-03-25 1983-10-01 Shimada Phys & Chem Ind Co Ltd Ultrasonic vibration cutting device
JPS58191901U (en) * 1982-06-16 1983-12-20 島田理化工業株式会社 Ultrasonic vibration cutting equipment

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