JPS5717126A - Manufacture of silicon carbide process tube for semiconductor - Google Patents
Manufacture of silicon carbide process tube for semiconductorInfo
- Publication number
- JPS5717126A JPS5717126A JP9093280A JP9093280A JPS5717126A JP S5717126 A JPS5717126 A JP S5717126A JP 9093280 A JP9093280 A JP 9093280A JP 9093280 A JP9093280 A JP 9093280A JP S5717126 A JPS5717126 A JP S5717126A
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- graphite
- sic
- process tube
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/01—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes on temporary substrates, e.g. substrates subsequently removed by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02529—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
Abstract
PURPOSE:To manufacture a process tube having superior gas-impermeability by a method wherein after SiC is made to grow vapor phase epitaxially around a graphite pipe, the graphite pipe is burnt to be removed. CONSTITUTION:The graphite pipe 13 treated to obtain high purity is accomodated in the reaction tube 1 of a mobile high-frequency heater, the pipe is covered with a graphite electrode 8, methlchlorosilane or SiCl4 and toluene or chlorosilane and toluene are introduced from a gas feeding pipe 10 (11 is a nozzle for measurement of pressure in the pipe) making H2 as a carrier gas, the pipe is heated at 1,000 deg.C or more by a high-frequency work coil 3 to make SiC to be accumulated on the inner circumferential face of the pipe 13, and then the pipe is heated in an oxidizing atmosphere to make the pipe to be removed, and the SiC tube is formed. Accordingly the process tube having no contamination to be generated by rediffusion of impurity, having small speed of oxidation, and being not to be deformed thermally and having long life can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9093280A JPS5717126A (en) | 1980-07-03 | 1980-07-03 | Manufacture of silicon carbide process tube for semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9093280A JPS5717126A (en) | 1980-07-03 | 1980-07-03 | Manufacture of silicon carbide process tube for semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5717126A true JPS5717126A (en) | 1982-01-28 |
Family
ID=14012213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9093280A Pending JPS5717126A (en) | 1980-07-03 | 1980-07-03 | Manufacture of silicon carbide process tube for semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5717126A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5978529A (en) * | 1982-10-28 | 1984-05-07 | Toshiba Ceramics Co Ltd | Silicon carbide material for manufacturing semiconductor |
JP2003034867A (en) * | 2001-07-27 | 2003-02-07 | Tokai Carbon Co Ltd | TUBULAR SiC-COMPACT AND MANUFACTURING METHOD THEREFOR |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4826597A (en) * | 1971-08-04 | 1973-04-07 | ||
JPS5015478A (en) * | 1973-04-26 | 1975-02-18 |
-
1980
- 1980-07-03 JP JP9093280A patent/JPS5717126A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4826597A (en) * | 1971-08-04 | 1973-04-07 | ||
JPS5015478A (en) * | 1973-04-26 | 1975-02-18 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5978529A (en) * | 1982-10-28 | 1984-05-07 | Toshiba Ceramics Co Ltd | Silicon carbide material for manufacturing semiconductor |
JP2003034867A (en) * | 2001-07-27 | 2003-02-07 | Tokai Carbon Co Ltd | TUBULAR SiC-COMPACT AND MANUFACTURING METHOD THEREFOR |
JP4702712B2 (en) * | 2001-07-27 | 2011-06-15 | 東海カーボン株式会社 | Tubular SiC molded body and method for producing the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5155062A (en) | Method for silicon carbide chemical vapor deposition using levitated wafer system | |
US3943218A (en) | Method of manufacturing shaped hollow bodies | |
KR850001942B1 (en) | Gas curtain continuous chemical vapor deposition production of semiconductor bodies | |
JPS55110032A (en) | Method for high-frequency heated epitaxial growth | |
JPS55144499A (en) | Producing silicon carbide crystal layer | |
JPS57158370A (en) | Formation of metallic thin film | |
JPS5717126A (en) | Manufacture of silicon carbide process tube for semiconductor | |
JPS54157780A (en) | Production of silicon single crystal | |
JP2550024B2 (en) | Low pressure CVD equipment | |
JPS5623736A (en) | Vapor phase growing method | |
JPS577923A (en) | Manufacture of receiving table for processing single silicon crystal wafer | |
US3069244A (en) | Production of silicon | |
JPS5710937A (en) | Plasma gaseous phase growth device | |
JPS56124228A (en) | Method for low-tension epitaxial growth | |
JPS55144500A (en) | Producing silicon carbide crystal layer | |
JPS5493357A (en) | Growing method of polycrystal silicon | |
JPS56169320A (en) | Silicon carbide semiconductor | |
JPS55149195A (en) | Manufacture of silicon carbide substrate | |
JPS54121283A (en) | Manufacture of silicon single crystal by pulling method and apparatus therefor | |
JPS57175797A (en) | Epitaxial growth under reduced pressure | |
JPS5748227A (en) | Manufacture of semiconductor device | |
JPS5626800A (en) | Vapor phase epitaxial growing method | |
JPS55110034A (en) | Method for growing epitaxial layer | |
JPS54144868A (en) | Heat treatment unit | |
JPS6145853B2 (en) |