JPS57168766A - Oscillating body for ultrasonic soldering - Google Patents

Oscillating body for ultrasonic soldering

Info

Publication number
JPS57168766A
JPS57168766A JP56054013A JP5401381A JPS57168766A JP S57168766 A JPS57168766 A JP S57168766A JP 56054013 A JP56054013 A JP 56054013A JP 5401381 A JP5401381 A JP 5401381A JP S57168766 A JPS57168766 A JP S57168766A
Authority
JP
Japan
Prior art keywords
curved
solder
ultrasonic
loop
oscillator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56054013A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6341675B2 (enrdf_load_stackoverflow
Inventor
Eiji Mori
Masaharu Morita
Isao Suzuki
Haimi Takasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56054013A priority Critical patent/JPS57168766A/ja
Publication of JPS57168766A publication Critical patent/JPS57168766A/ja
Publication of JPS6341675B2 publication Critical patent/JPS6341675B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0661—Oscillating baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
JP56054013A 1981-04-10 1981-04-10 Oscillating body for ultrasonic soldering Granted JPS57168766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56054013A JPS57168766A (en) 1981-04-10 1981-04-10 Oscillating body for ultrasonic soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56054013A JPS57168766A (en) 1981-04-10 1981-04-10 Oscillating body for ultrasonic soldering

Publications (2)

Publication Number Publication Date
JPS57168766A true JPS57168766A (en) 1982-10-18
JPS6341675B2 JPS6341675B2 (enrdf_load_stackoverflow) 1988-08-18

Family

ID=12958697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56054013A Granted JPS57168766A (en) 1981-04-10 1981-04-10 Oscillating body for ultrasonic soldering

Country Status (1)

Country Link
JP (1) JPS57168766A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6465244B1 (ja) * 2017-09-29 2019-02-06 ダイキン工業株式会社 はんだ付け装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6465244B1 (ja) * 2017-09-29 2019-02-06 ダイキン工業株式会社 はんだ付け装置
WO2019065511A1 (ja) * 2017-09-29 2019-04-04 ダイキン工業株式会社 はんだ付け装置

Also Published As

Publication number Publication date
JPS6341675B2 (enrdf_load_stackoverflow) 1988-08-18

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