JPS57167648A - Processing and inspecting device for electronic part - Google Patents

Processing and inspecting device for electronic part

Info

Publication number
JPS57167648A
JPS57167648A JP56045094A JP4509481A JPS57167648A JP S57167648 A JPS57167648 A JP S57167648A JP 56045094 A JP56045094 A JP 56045094A JP 4509481 A JP4509481 A JP 4509481A JP S57167648 A JPS57167648 A JP S57167648A
Authority
JP
Japan
Prior art keywords
inspected
detection
tracking
reflections
marker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56045094A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6348178B2 (enExample
Inventor
Masahito Nakajima
Tetsuo Hizuka
Masato Miyamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56045094A priority Critical patent/JPS57167648A/ja
Publication of JPS57167648A publication Critical patent/JPS57167648A/ja
Publication of JPS6348178B2 publication Critical patent/JPS6348178B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP56045094A 1981-03-27 1981-03-27 Processing and inspecting device for electronic part Granted JPS57167648A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56045094A JPS57167648A (en) 1981-03-27 1981-03-27 Processing and inspecting device for electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56045094A JPS57167648A (en) 1981-03-27 1981-03-27 Processing and inspecting device for electronic part

Publications (2)

Publication Number Publication Date
JPS57167648A true JPS57167648A (en) 1982-10-15
JPS6348178B2 JPS6348178B2 (enExample) 1988-09-28

Family

ID=12709714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56045094A Granted JPS57167648A (en) 1981-03-27 1981-03-27 Processing and inspecting device for electronic part

Country Status (1)

Country Link
JP (1) JPS57167648A (enExample)

Also Published As

Publication number Publication date
JPS6348178B2 (enExample) 1988-09-28

Similar Documents

Publication Publication Date Title
JPS57165836A (en) Method and apparatus for tracing and recording object to be traced
MY112312A (en) Method and apparatus for automated docking of a test head to a device handler
GB2154109A (en) Ship collision preventive aid apparatus
JPS5429643A (en) Service life detecting and display method of parts of copying machines
JPS53117978A (en) Automatic mask appearance inspection apparatus
GR3021560T3 (en) Apparatus for the detection of defects in a moving band
JPS57167648A (en) Processing and inspecting device for electronic part
JPS5424539A (en) Liquid crystal type tablet
JPS5416997A (en) Method of displayin position information by longitude and latitude in radar video display device
SE8201495L (sv) Koordinatmetningssystem
JPS5489767A (en) Moving displaying method of charts
JPS5657908A (en) Moving position displaying device for automobile
JPS5661604A (en) Range finder in scanning electronic microscope
JPS5278467A (en) Method of determining reference points for measurement of configuratio n
JPH09133512A (ja) 光学式三次元測定方法
TW358247B (en) Radar mask direction tolerance automatic testing method and device
JPS5243355A (en) Test data transfer device for electric particle line eqipment
JPS53119672A (en) Integrated circuit with malfunction display device
SU1147961A1 (ru) Способ определени координат дефекта в материале
JPS52143770A (en) Mask aligning method
JPS57125309A (en) Coordinate reading method
JPS5456378A (en) Wafer prober apparatus
JPS6419420A (en) Three-dimensional direction designating device
JPS5572210A (en) Drive control system for circuit testing prober
FI70834B (fi) Rithjaelpmedel foer ritning av perspektivritningar