JPS5716739B2 - - Google Patents

Info

Publication number
JPS5716739B2
JPS5716739B2 JP11417077A JP11417077A JPS5716739B2 JP S5716739 B2 JPS5716739 B2 JP S5716739B2 JP 11417077 A JP11417077 A JP 11417077A JP 11417077 A JP11417077 A JP 11417077A JP S5716739 B2 JPS5716739 B2 JP S5716739B2
Authority
JP
Japan
Prior art keywords
layer
wiring substrate
bonding
semiconductor device
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11417077A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5447569A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11417077A priority Critical patent/JPS5447569A/ja
Publication of JPS5447569A publication Critical patent/JPS5447569A/ja
Publication of JPS5716739B2 publication Critical patent/JPS5716739B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Die Bonding (AREA)
JP11417077A 1977-09-22 1977-09-22 Packaging method of semiconductor device Granted JPS5447569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11417077A JPS5447569A (en) 1977-09-22 1977-09-22 Packaging method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11417077A JPS5447569A (en) 1977-09-22 1977-09-22 Packaging method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5447569A JPS5447569A (en) 1979-04-14
JPS5716739B2 true JPS5716739B2 (hu) 1982-04-07

Family

ID=14630916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11417077A Granted JPS5447569A (en) 1977-09-22 1977-09-22 Packaging method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5447569A (hu)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940065A (hu) * 1972-08-17 1974-04-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940065A (hu) * 1972-08-17 1974-04-15

Also Published As

Publication number Publication date
JPS5447569A (en) 1979-04-14

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