JPS57166024A - Bonding device for wafer - Google Patents
Bonding device for waferInfo
- Publication number
- JPS57166024A JPS57166024A JP5050881A JP5050881A JPS57166024A JP S57166024 A JPS57166024 A JP S57166024A JP 5050881 A JP5050881 A JP 5050881A JP 5050881 A JP5050881 A JP 5050881A JP S57166024 A JPS57166024 A JP S57166024A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- wafers
- adhesives
- chamber
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5050881A JPS57166024A (en) | 1981-04-06 | 1981-04-06 | Bonding device for wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5050881A JPS57166024A (en) | 1981-04-06 | 1981-04-06 | Bonding device for wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57166024A true JPS57166024A (en) | 1982-10-13 |
JPS6119110B2 JPS6119110B2 (US06566495-20030520-M00011.png) | 1986-05-15 |
Family
ID=12860894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5050881A Granted JPS57166024A (en) | 1981-04-06 | 1981-04-06 | Bonding device for wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57166024A (US06566495-20030520-M00011.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59101849A (ja) * | 1982-12-01 | 1984-06-12 | Tokyo Erekutoron Kk | 物品移送装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6124886A (ja) * | 1984-07-14 | 1986-02-03 | Hitachi Constr Mach Co Ltd | パイロツト操作回路の暖気装置 |
-
1981
- 1981-04-06 JP JP5050881A patent/JPS57166024A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59101849A (ja) * | 1982-12-01 | 1984-06-12 | Tokyo Erekutoron Kk | 物品移送装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6119110B2 (US06566495-20030520-M00011.png) | 1986-05-15 |
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