JPS57164544A - Automatic transfer equipment for semiconductor substrate - Google Patents

Automatic transfer equipment for semiconductor substrate

Info

Publication number
JPS57164544A
JPS57164544A JP4715181A JP4715181A JPS57164544A JP S57164544 A JPS57164544 A JP S57164544A JP 4715181 A JP4715181 A JP 4715181A JP 4715181 A JP4715181 A JP 4715181A JP S57164544 A JPS57164544 A JP S57164544A
Authority
JP
Japan
Prior art keywords
wafers
wafer
nozzles
float
pressurized gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4715181A
Other languages
Japanese (ja)
Other versions
JPS617739B2 (en
Inventor
Hitoshi Ogi
Etsuo Sakuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to JP4715181A priority Critical patent/JPS57164544A/en
Publication of JPS57164544A publication Critical patent/JPS57164544A/en
Publication of JPS617739B2 publication Critical patent/JPS617739B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)

Abstract

PURPOSE:To make wafers float and control the direction and the speed of the movement of the wafers by the direction of nozzles and the jetting power by blowing air or nitrogen gas against the wafers. CONSTITUTION:When pressurized gas is blown from nozzles 9 against wafer 2 (2-1 and 2-2) on a rotating disc 1, the wafers float. Three rows of the nozzles are provided along the direction of tansferring the wafers and the wafers are made float by two rows on the right and the left side and transferred to the transfer direction by the middle row. The wafer transferred to the end point comes in contact with a stopper S1 and the supply of the pressurized gas to pressurized gas inlets 11a and 11b is discontinued and the wafer droppes on a belt conveyer 7. In order to avoid the damage of the wafer, direction and pressure of central nozzles are adjusted so as to reduce the transfer speed at the point near the end point.
JP4715181A 1981-04-01 1981-04-01 Automatic transfer equipment for semiconductor substrate Granted JPS57164544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4715181A JPS57164544A (en) 1981-04-01 1981-04-01 Automatic transfer equipment for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4715181A JPS57164544A (en) 1981-04-01 1981-04-01 Automatic transfer equipment for semiconductor substrate

Publications (2)

Publication Number Publication Date
JPS57164544A true JPS57164544A (en) 1982-10-09
JPS617739B2 JPS617739B2 (en) 1986-03-08

Family

ID=12767086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4715181A Granted JPS57164544A (en) 1981-04-01 1981-04-01 Automatic transfer equipment for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS57164544A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019245915A1 (en) * 2018-06-18 2019-12-26 Veeco Precision Surface Processing Llc Apparatus for supporting and maneuvering wafers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019245915A1 (en) * 2018-06-18 2019-12-26 Veeco Precision Surface Processing Llc Apparatus for supporting and maneuvering wafers

Also Published As

Publication number Publication date
JPS617739B2 (en) 1986-03-08

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