JPS57164544A - Automatic transfer equipment for semiconductor substrate - Google Patents
Automatic transfer equipment for semiconductor substrateInfo
- Publication number
- JPS57164544A JPS57164544A JP4715181A JP4715181A JPS57164544A JP S57164544 A JPS57164544 A JP S57164544A JP 4715181 A JP4715181 A JP 4715181A JP 4715181 A JP4715181 A JP 4715181A JP S57164544 A JPS57164544 A JP S57164544A
- Authority
- JP
- Japan
- Prior art keywords
- wafers
- wafer
- nozzles
- float
- pressurized gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Abstract
PURPOSE:To make wafers float and control the direction and the speed of the movement of the wafers by the direction of nozzles and the jetting power by blowing air or nitrogen gas against the wafers. CONSTITUTION:When pressurized gas is blown from nozzles 9 against wafer 2 (2-1 and 2-2) on a rotating disc 1, the wafers float. Three rows of the nozzles are provided along the direction of tansferring the wafers and the wafers are made float by two rows on the right and the left side and transferred to the transfer direction by the middle row. The wafer transferred to the end point comes in contact with a stopper S1 and the supply of the pressurized gas to pressurized gas inlets 11a and 11b is discontinued and the wafer droppes on a belt conveyer 7. In order to avoid the damage of the wafer, direction and pressure of central nozzles are adjusted so as to reduce the transfer speed at the point near the end point.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4715181A JPS57164544A (en) | 1981-04-01 | 1981-04-01 | Automatic transfer equipment for semiconductor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4715181A JPS57164544A (en) | 1981-04-01 | 1981-04-01 | Automatic transfer equipment for semiconductor substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57164544A true JPS57164544A (en) | 1982-10-09 |
JPS617739B2 JPS617739B2 (en) | 1986-03-08 |
Family
ID=12767086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4715181A Granted JPS57164544A (en) | 1981-04-01 | 1981-04-01 | Automatic transfer equipment for semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57164544A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019245915A1 (en) * | 2018-06-18 | 2019-12-26 | Veeco Precision Surface Processing Llc | Apparatus for supporting and maneuvering wafers |
-
1981
- 1981-04-01 JP JP4715181A patent/JPS57164544A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019245915A1 (en) * | 2018-06-18 | 2019-12-26 | Veeco Precision Surface Processing Llc | Apparatus for supporting and maneuvering wafers |
Also Published As
Publication number | Publication date |
---|---|
JPS617739B2 (en) | 1986-03-08 |
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