CN111863684A - Wafer carrying mechanism with adjustable finger spacing - Google Patents

Wafer carrying mechanism with adjustable finger spacing Download PDF

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Publication number
CN111863684A
CN111863684A CN202010727646.5A CN202010727646A CN111863684A CN 111863684 A CN111863684 A CN 111863684A CN 202010727646 A CN202010727646 A CN 202010727646A CN 111863684 A CN111863684 A CN 111863684A
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CN
China
Prior art keywords
air
bottom plate
air outlet
vertical
air nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010727646.5A
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Chinese (zh)
Inventor
郭强
杜荣赫
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Shenyang Fortune Precision Equipment Co Ltd
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Shenyang Fortune Precision Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenyang Fortune Precision Equipment Co Ltd filed Critical Shenyang Fortune Precision Equipment Co Ltd
Priority to CN202010727646.5A priority Critical patent/CN111863684A/en
Publication of CN111863684A publication Critical patent/CN111863684A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to the technical field of photovoltaic carrying robots, and particularly provides a wafer carrying mechanism with adjustable finger spacing, which is characterized by comprising a bottom plate, guide strips, vertical air outlet holes, an inclined air nozzle, a sensor, an air nozzle air inlet, an air nozzle fixing block, an air nozzle angle adjusting shaft, a vertical air outlet hole air supply block and a vertical air outlet hole air inlet; two side surfaces of one end of the bottom plate are provided with guide strips; two rows of vertical air outlet holes are arranged on the bottom plate; the other end of the bottom plate is provided with two inclined air nozzles through an air nozzle fixing block and an air nozzle angle adjusting shaft, and is also provided with a sensor; the back of the bottom plate is provided with an air nozzle air inlet connected with the inclined air nozzle; the back of the bottom plate is provided with a vertical air outlet hole air supply block connected with a vertical air outlet hole, and the vertical air outlet hole air supply block is provided with a vertical air outlet hole air inlet. The device can meet the requirement of non-contact type sheet taking of the photovoltaic lower surface in a small space, adopts a blowing mode, and has the advantages of compact structure, light weight and stable transmission.

Description

Wafer carrying mechanism with adjustable finger spacing
Technical Field
The invention relates to the technical field of wafer carrying robots, in particular to a wafer carrying mechanism with an adjustable finger space.
Background
Currently, in a photovoltaic manufacturing process, the wafer cassette is generally required to be switched between different manufacturing devices. The lower surface of the photovoltaic piece is very fragile and easy to damage after the lower surface flocking process is completed, and the photovoltaic piece is taken out from the basket without damaging the flocking surface by a carrying robot and is transmitted to the next procedure.
Traditional finger mechanism can only take out it in the basket of flowers through the mode of contact photovoltaic piece lower surface or vacuum suction photovoltaic piece upper surface, for not destroying the photovoltaic piece flocking can't use contact finger and belt to get the piece under surface flocking technology, uses upper surface vacuum finger to get piece speed with greatly reduced.
Disclosure of Invention
In order to solve the above technical problems, an object of the present invention is to provide a wafer carrying mechanism with adjustable finger spacing, wherein the rear end of the finger can be directly connected to a conveyor belt or a robot.
In order to achieve the purpose, the invention adopts the following technical scheme:
a wafer carrying mechanism with adjustable finger spacing comprises a bottom plate, guide strips, vertical air outlet holes, an inclined air nozzle, a sensor, an air nozzle air inlet, an air nozzle fixing block, an air nozzle angle adjusting shaft, a vertical air outlet hole air supply block and a vertical air outlet hole air inlet; two side surfaces of one end of the bottom plate are provided with guide strips; two rows of vertical air outlet holes are arranged on the bottom plate; the other end of the bottom plate is provided with two inclined air nozzles through an air nozzle fixing block and an air nozzle angle adjusting shaft, and is also provided with a sensor; the back of the bottom plate is provided with an air nozzle air inlet connected with the inclined air nozzle; the back of the bottom plate is provided with a vertical air outlet hole air supply block connected with a vertical air outlet hole, and the vertical air outlet hole air supply block is provided with a vertical air outlet hole air inlet.
The invention has the advantages and beneficial effects that:
1. the invention provides a horizontal non-contact type film taking finger which can meet the transmission requirement of flocking photovoltaic films on the lower surface among different processes, and the photovoltaic films in a flower basket are detected by a sensor, and air holes and nozzles are controlled by an electromagnetic valve to jet air so as to realize high-efficiency film taking. The transmission efficiency in the manufacturing and production process of the photovoltaic sheet is improved on the premise of not damaging the flocked surface.
2. The invention realizes high-speed and high-precision film taking and transmission by being arranged on a robot and replacing the original belt film taking finger. The speed of taking the photovoltaic film is effectively solved, and the productivity of the equipment is improved.
Drawings
Fig. 1 is a top plan view of the present invention during operation.
Fig. 2 is a top view of the overall structure of the present invention.
Fig. 3 is a bottom view of the present invention.
Fig. 4 is one of the side views of the present invention.
Fig. 5 is a second side view of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1-5, a wafer carrying mechanism with adjustable finger spacing comprises a bottom plate 2, guide strips 3, vertical air outlets 4, an inclined air nozzle 5, a sensor 6, an air nozzle air inlet 7, an air nozzle fixing block 8, an air nozzle angle adjusting shaft 9, a vertical air outlet air supply block 10 and a vertical air outlet air inlet 12; two side surfaces of one end of the bottom plate 2 are provided with guide strips 3; two rows of vertical air outlet holes 4 are arranged on the bottom plate 2; the other end of the bottom plate 2 is provided with two inclined air nozzles 5 through an air nozzle fixing block 8 and an air nozzle angle adjusting shaft 9, and is also provided with a sensor 6;
the back of the bottom plate 2 is provided with an air nozzle air inlet 7 connected with the inclined air nozzle 5;
the back of the bottom plate 2 is provided with a vertical air outlet hole air supply block 10 connected with the vertical air outlet hole 4, and the vertical air outlet hole air supply block 10 is provided with a vertical air outlet hole air inlet 12.
The bottom plate 2 is provided with a guide strip adjustable fixing hole 11 for adjusting the distance between the guide strips 3.
When the bottom plate 2 extends into the flower basket and the sensor detects the photovoltaic sheet, the electromagnetic valve is controlled to be opened, compressed air is flushed into the air supply block with the vertical air outlet holes and is discharged from the vertical air outlet holes to form an air cushion, and the photovoltaic sheet is blown up to be suspended above the bottom plate 2;
the slope air nozzle 5 is fixed in on the air nozzle fixed block 8 through air nozzle angle adjustment axle 9, and it is adjustable to realize slope air nozzle 5 angle of giving vent to anger, after the photovoltaic piece suspension, opens through control solenoid valve, gets into slope air nozzle 5 with compressed air by the nozzle air inlet, and slope air nozzle 5 blowout is gaseous to drive the horizontal motion backward of photovoltaic piece, makes the photovoltaic piece follow air guide rail rearward movement, takes out the photovoltaic piece in the basket of flowers, moves more than the repetition until with whole basket of flowers in the photovoltaic piece all take out.
The working principle of the invention is as follows:
the electromagnetic valve controls compressed air to inflate the fingers, and the compressed air is sprayed out from the vertical air outlet holes of the fingers to form an air cushion effect on the surfaces of the fingers. The photovoltaic piece floats on the surface of the finger, and the floating height of the photovoltaic piece can be adjusted by adjusting the inflation pressure. The solenoid valve controls the inclined nozzle to spray compressed air, the photovoltaic sheet is blown out in the flower basket along the finger direction, and the movement speed of the photovoltaic sheet is adjusted by controlling the blowing pressure. The motion range of the photovoltaic sheet on the finger is limited by the guide strips on the two sides.
The finger provided by the invention can take out the photovoltaic sheet in a non-contact manner in a horizontal state. Thoroughly solve the photovoltaic piece lower surface damage that causes by the finger when getting the piece at a high speed. The transmission efficiency of the photovoltaic sheet manufacturing production process is improved.
The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention, and any modifications, equivalents, improvements, extensions, etc. made within the spirit and principle of the present invention are included in the scope of the present invention.

Claims (3)

1. A wafer carrying mechanism with adjustable finger spacing is characterized by comprising a bottom plate, guide strips, vertical air outlet holes, an inclined air nozzle, a sensor, an air nozzle air inlet, an air nozzle fixing block, an air nozzle angle adjusting shaft, a vertical air outlet hole air supply block and a vertical air outlet hole air inlet;
two side surfaces of one end of the bottom plate are provided with guide strips; two rows of vertical air outlet holes are arranged on the bottom plate;
the other end of the bottom plate is provided with two inclined air nozzles through an air nozzle fixing block and an air nozzle angle adjusting shaft, and is also provided with a sensor;
the back of the bottom plate is provided with an air nozzle air inlet connected with the inclined air nozzle;
the back of the bottom plate is provided with a vertical air outlet hole air supply block connected with a vertical air outlet hole, and the vertical air outlet hole air supply block is provided with a vertical air outlet hole air inlet.
2. The wafer carrying mechanism with adjustable finger spacing as claimed in claim 1, wherein the bottom plate has fixing holes for adjusting the spacing of the guide bars.
3. The wafer carrying mechanism with adjustable finger spacing as claimed in claim 1, wherein when the sensor that the bottom plate extends into the basket detects the photovoltaic plate, compressed air is blown into the vertical air outlet air supply block and exhausted from the vertical air outlet to form an air cushion, and the photovoltaic plate is blown up to be suspended above the bottom plate;
the inclined air nozzle is fixed on the air nozzle fixing block through the air nozzle angle adjusting shaft, the air outlet angle of the inclined air nozzle can be adjusted, compressed air enters the inclined air nozzle from the nozzle air inlet after the photovoltaic piece is suspended, the air sprayed by the inclined air nozzle drives the photovoltaic piece to move backwards, the photovoltaic piece moves backwards along the air guide rail, the photovoltaic piece is taken out of the basket, and the action is repeated until the photovoltaic piece in the whole basket is taken out.
CN202010727646.5A 2020-07-23 2020-07-23 Wafer carrying mechanism with adjustable finger spacing Pending CN111863684A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010727646.5A CN111863684A (en) 2020-07-23 2020-07-23 Wafer carrying mechanism with adjustable finger spacing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010727646.5A CN111863684A (en) 2020-07-23 2020-07-23 Wafer carrying mechanism with adjustable finger spacing

Publications (1)

Publication Number Publication Date
CN111863684A true CN111863684A (en) 2020-10-30

Family

ID=72950967

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010727646.5A Pending CN111863684A (en) 2020-07-23 2020-07-23 Wafer carrying mechanism with adjustable finger spacing

Country Status (1)

Country Link
CN (1) CN111863684A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261145A (en) * 2001-03-02 2002-09-13 Kanayama Seiki Co Ltd Wafer taking-out and storing device
KR100805278B1 (en) * 2006-11-29 2008-02-20 주식회사 테스 Wafer transfer robot and cluster tool having the same
TW201135863A (en) * 2009-10-14 2011-10-16 Rorze Corp Apparatus for holding thin-board-like material and method for holding thin-board-like material
CN203095155U (en) * 2012-12-20 2013-07-31 黄林 Air injection sliding chute
TW201520156A (en) * 2013-11-21 2015-06-01 Auo Crystal Corp Method and device of airflow driving for taking wafer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261145A (en) * 2001-03-02 2002-09-13 Kanayama Seiki Co Ltd Wafer taking-out and storing device
KR100805278B1 (en) * 2006-11-29 2008-02-20 주식회사 테스 Wafer transfer robot and cluster tool having the same
TW201135863A (en) * 2009-10-14 2011-10-16 Rorze Corp Apparatus for holding thin-board-like material and method for holding thin-board-like material
CN203095155U (en) * 2012-12-20 2013-07-31 黄林 Air injection sliding chute
TW201520156A (en) * 2013-11-21 2015-06-01 Auo Crystal Corp Method and device of airflow driving for taking wafer

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Address after: No.18a-1, Feiyun Road, Hunnan District, Shenyang City, Liaoning Province

Applicant after: Shenyang fuchuang precision equipment Co.,Ltd.

Address before: No.18a-1, Feiyun Road, Dongling District, Shenyang, Liaoning Province, 110000

Applicant before: Shenyang Fortune Precision Equipment Co.,Ltd.