JPS617739B2 - - Google Patents

Info

Publication number
JPS617739B2
JPS617739B2 JP4715181A JP4715181A JPS617739B2 JP S617739 B2 JPS617739 B2 JP S617739B2 JP 4715181 A JP4715181 A JP 4715181A JP 4715181 A JP4715181 A JP 4715181A JP S617739 B2 JPS617739 B2 JP S617739B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4715181A
Other languages
Japanese (ja)
Other versions
JPS57164544A (en
Inventor
Hitoshi Ogi
Etsuo Sakuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to JP4715181A priority Critical patent/JPS57164544A/en
Publication of JPS57164544A publication Critical patent/JPS57164544A/en
Publication of JPS617739B2 publication Critical patent/JPS617739B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
JP4715181A 1981-04-01 1981-04-01 Automatic transfer equipment for semiconductor substrate Granted JPS57164544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4715181A JPS57164544A (en) 1981-04-01 1981-04-01 Automatic transfer equipment for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4715181A JPS57164544A (en) 1981-04-01 1981-04-01 Automatic transfer equipment for semiconductor substrate

Publications (2)

Publication Number Publication Date
JPS57164544A JPS57164544A (en) 1982-10-09
JPS617739B2 true JPS617739B2 (en) 1986-03-08

Family

ID=12767086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4715181A Granted JPS57164544A (en) 1981-04-01 1981-04-01 Automatic transfer equipment for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS57164544A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202002135A (en) * 2018-06-18 2020-01-01 美商維克精密表面處理股份有限公司 Apparatus for supporting and maneuvering wafers

Also Published As

Publication number Publication date
JPS57164544A (en) 1982-10-09

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