JPS5716167A - Suttering apparatus - Google Patents

Suttering apparatus

Info

Publication number
JPS5716167A
JPS5716167A JP9054180A JP9054180A JPS5716167A JP S5716167 A JPS5716167 A JP S5716167A JP 9054180 A JP9054180 A JP 9054180A JP 9054180 A JP9054180 A JP 9054180A JP S5716167 A JPS5716167 A JP S5716167A
Authority
JP
Japan
Prior art keywords
atom
target
sputtering
irradiated
sputtering apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9054180A
Other languages
Japanese (ja)
Other versions
JPS5932545B2 (en
Inventor
Ichiro Fujita
Toshihiko Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9054180A priority Critical patent/JPS5932545B2/en
Publication of JPS5716167A publication Critical patent/JPS5716167A/en
Publication of JPS5932545B2 publication Critical patent/JPS5932545B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE:To attain to simplify the sputtering apparatus and to enhance film quality formed on a substrate by sputtering by a method wherein an atom projected obliquely from a target to the substrate plate is blocked and a shutter plate cutting irradiated atom is provided according to necessity. CONSTITUTION:The sputtering apparatus has a ring like cylindrical substrate plate holder 1 rotatable around a rotary shaft 3 as a center and a target 5 irradiating a desired atom. The atom forming the target 5 is projected from an irradiation surface 6 to all directions. In thus constituted sputtering apparatus, a shutter plate 12 is provided so as to partially enclose the target 5 and the atom in an oblique direction irradiated to an adjacent wafer 10 not opposed to the irradiation surface 6 from a front surface is cut. Further, in order to shut the poluted irradiated atom generated directly after the sputtering is initiated, the plate is reversely rotated to a second position 12' for a definite time to prevent said atom from being reached to the wafer 10.
JP9054180A 1980-07-04 1980-07-04 sputtering equipment Expired JPS5932545B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9054180A JPS5932545B2 (en) 1980-07-04 1980-07-04 sputtering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9054180A JPS5932545B2 (en) 1980-07-04 1980-07-04 sputtering equipment

Publications (2)

Publication Number Publication Date
JPS5716167A true JPS5716167A (en) 1982-01-27
JPS5932545B2 JPS5932545B2 (en) 1984-08-09

Family

ID=14001267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9054180A Expired JPS5932545B2 (en) 1980-07-04 1980-07-04 sputtering equipment

Country Status (1)

Country Link
JP (1) JPS5932545B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01266040A (en) * 1988-04-15 1989-10-24 Mazda Motor Corp Structure for supporting bumper of automobile

Also Published As

Publication number Publication date
JPS5932545B2 (en) 1984-08-09

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